A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties
Abstract
:1. Introduction
2. Experimental Section
2.1. Materials
2.2. Synthesis of Phenolic Hydroxyl-Terminated Siloxane (PHS)
2.3. Synthesis of Acetylene-Functional/Silicon-Containing Benzoxazine Resin (ASB)
2.4. Preparation of Polybenzoxazines
2.5. Instruments
3. Results and Discussion
3.1. Synthesis of PHS, AB and ASB
3.2. Rheological Analysis
3.3. DSC Analysis
3.4. Research on Resin Curing Reaction Kinetics
3.5. TGA Analysis
3.6. Mechanical Property Analysis
4. Conclusions
Author Contributions
Funding
Conflicts of Interest
References
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Heating Rate (°C/min) | Initial (°C) | Peak (°C) | End (°C) |
---|---|---|---|
5 | 169.2 | 197.9 | 250.8 |
10 | 178.6 | 211.9 | 251.7 |
15 | 188.8 | 218.6 | 261.7 |
20 | 192.5 | 228.6 | 266.7 |
Heating Rate (°C/min) | Initial (°C) | Peak (°C) | End (°C) |
---|---|---|---|
5 | 146.6 | 179.9 | 241.2 |
10 | 161.8 | 187.1 | 238.8 |
15 | 166.2 | 200.0 | 248.6 |
20 | 171.1 | 204.6 | 259.2 |
Resin | In Air | In Nitrogen | ||
---|---|---|---|---|
Td5/°C | Yc at 1000 °C | Td5/°C | Yc at 1000 °C | |
AB | 360 | 2% | 436 | 72% |
ASB | 380 | 21% | 485 | 80% |
Mechanical Property | AB | ASB |
---|---|---|
Tensile Strength/MPa | 76.8 ± 2.85 | 78.2 ± 1.85 |
Flexural Strength/MPa | 141.8 ± 5.87 | 149.3 ± 4.56 |
Impact Strength/kJ/m2 | 24.2 ± 2.17 | 32.8 ± 2.89 |
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Mei, Q.; Wang, H.; Tong, D.; Song, J.; Huang, Z. A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers 2020, 12, 999. https://doi.org/10.3390/polym12050999
Mei Q, Wang H, Tong D, Song J, Huang Z. A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers. 2020; 12(5):999. https://doi.org/10.3390/polym12050999
Chicago/Turabian StyleMei, Qilin, Honghua Wang, Danliao Tong, Jiuqiang Song, and Zhixiong Huang. 2020. "A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties" Polymers 12, no. 5: 999. https://doi.org/10.3390/polym12050999
APA StyleMei, Q., Wang, H., Tong, D., Song, J., & Huang, Z. (2020). A Novel Acetylene-Functional/Silicon-Containing Benzoxazine Resin: Preparation, Curing Kinetics and Thermal Properties. Polymers, 12(5), 999. https://doi.org/10.3390/polym12050999