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Journal: Polymers, 2021
Volume: 13
Number: 1734
Article:
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis
Authors:
by
Erick Franieck, Martin Fleischmann, Ole Hölck, Larysa Kutuzova and Andreas Kandelbauer
Link:
https://www.mdpi.com/2073-4360/13/11/1734
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