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Journal: PolymersVolume: 16Number: 562
Article: Mold Fungal Resistance of Loose-Fill Thermal Insulation Materials Based on Processed Wheat Straw, Corn Stalk and Reed
- Authors:
- Ramunas Tupciauskas1,*,
- Zigmunds Orlovskis2,3 and
- Karlis Trevors Blums2,3
- et al.
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