Qian, B.; Fan, H.; Liu, G.; Zhang, J.; Li, P.
Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance. Metals 2021, 11, 1731.
https://doi.org/10.3390/met11111731
AMA Style
Qian B, Fan H, Liu G, Zhang J, Li P.
Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance. Metals. 2021; 11(11):1731.
https://doi.org/10.3390/met11111731
Chicago/Turabian Style
Qian, Bo, Hongri Fan, Gang Liu, Jianrui Zhang, and Pei Li.
2021. "Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance" Metals 11, no. 11: 1731.
https://doi.org/10.3390/met11111731
APA Style
Qian, B., Fan, H., Liu, G., Zhang, J., & Li, P.
(2021). Self-Supporting Microchannel Liquid-Cooled Plate for T/R Modules Based on Additive Manufacturing: Study on Its Pass Design, Formation Process and Boiling Heat Transfer Performance. Metals, 11(11), 1731.
https://doi.org/10.3390/met11111731