Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies
Abstract
:1. Introduction
2. Materials and Methods
2.1. Materials
2.2. Thermal Conductivity and Chemical Composition of Aggregate
2.3. Thermal Exchange of Chip Seal
2.4. Aggregate Morphology Features
2.5. Performance of Chip Seal
2.5.1. Surface Features
2.5.2. Aggregate Retention Performance
3. Results and Discussion
3.1. Properties of Aggregates
3.1.1. Thermal Behavior
3.1.2. Chemical and Phase Compositions
3.1.3. Morphology
3.2. Properties of Chip Seal
3.2.1. Thermal Exchange of Chip Seal
3.2.2. BPN and Texture Depth
3.2.3. Aggregate Loss
4. Conclusions
- The relative ranking of aggregate types according to thermal conductivity places BOF slag as the lowest and FER slag as the highest, with the basalt falling in between. The differences in thermal behavior can be attributed to the various chemical compositions.
- The morphologies of FER slag are more rounded and circular than those of the BS and BOF slag due to the air-granulated treatment methods, and BOF slag has the most abundant morphological features among the aggregates.
- The thermal exchange performances of chip seal made of FER slag are better than those of BOF slag and basalt. The recycling of FER slag as aggregate in chip seal can allow the chip seal to resume traffic about ten minutes earlier than original samples.
- The BPN and MTD values of chip seal made of FER slag are the worst among the three kinds of aggregate. However, they still meet the requirements of the specification, although they are less than those of ordinary aggregates.
- FER slag offers the best aggregate retention performance due to its spherical particles and alkaline surface. It can reduce the friction force and strengthen the interface bond between aggregate and asphalt.
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
References
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Sample ID | BS-1 | BS-2 | BOF-1 | BOF-2 | FER-1 | FER-2 | Method |
---|---|---|---|---|---|---|---|
Specific gravity (g/cm3) | 2.65 | 2.68 | 3.15 | 3.21 | 2.98 | 3.02 | ASTM C127 |
Sand equivalent (%) | 68 | 66 | 74 | 75 | 79 | 78 | ASTM D419 |
Water absorption ratio (%) | 0.42 | 0.49 | 1.35 | 1.69 | 1.07 | 1.14 | ASTM C127 |
Soundness by Na2SO4 (%) | 2.96 | 3.02 | 2.34 | 2.25 | 1.86 | 1.97 | ASTM C88 |
Polished stone value | 48 | 44 | 68 | 62 | 57 | 54 | EN 1097-8 |
Materials | MgO/% | Al2O3/% | SiO2/% | CaO/% | Fe2O3/% | Others/% |
---|---|---|---|---|---|---|
BS-1 | 7.1 | 15.4 | 50.0 | 8.6 | 14.5 | 4.4 |
BOF-1 | 5.1 | 1.8 | 25.5 | 47.4 | 13.6 | 6.6 |
FER-1 | 6.1 | 3.1 | 16.0 | 36.6 | 27.6 | 10.6 |
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Wei, M.; Wu, S.; Cui, P.; Yang, T.; Lv, Y. Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies. Appl. Sci. 2020, 10, 8192. https://doi.org/10.3390/app10228192
Wei M, Wu S, Cui P, Yang T, Lv Y. Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies. Applied Sciences. 2020; 10(22):8192. https://doi.org/10.3390/app10228192
Chicago/Turabian StyleWei, Minghua, Shaopeng Wu, Peide Cui, Tianyuan Yang, and Yang Lv. 2020. "Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies" Applied Sciences 10, no. 22: 8192. https://doi.org/10.3390/app10228192
APA StyleWei, M., Wu, S., Cui, P., Yang, T., & Lv, Y. (2020). Thermal Exchange and Skid Resistance of Chip Seal with Various Aggregate Types and Morphologies. Applied Sciences, 10(22), 8192. https://doi.org/10.3390/app10228192