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Journal: Appl. Sci., 2020
Volume: 10
Number: 8893

Article: Study on Electromigration Effects and IMC Formation on Cu–Sn Films Due to Current Stress and Temperature
Authors: by Zhao-Ying Wang, Nhat Minh Dang, Po-Hsun Wang, Terry Yuan-Fang Chen and Ming-Tzer Lin
Link: https://www.mdpi.com/2076-3417/10/24/8893

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