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Journal: Appl. Sci., 2020
Volume: 10
Number: 748

Article: Evaluation of the Potential Electromagnetic Interference in Vertically Stacked 3D Integrated Circuits
Authors: by Dipesh Kapoor, Cher Ming Tan and Vivek Sangwan
Link: https://www.mdpi.com/2076-3417/10/3/748

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