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Journal: Appl. Sci., 2021
Volume: 11
Number: 9702

Article: A Study on Sputtering of Copper Seed Layer for Interconnect Metallization via Molecular Dynamics Simulation
Authors: by Cheng-Hsuan Ho, Cha’o-Kuang Chen and Chieh-Li Chen
Link: https://www.mdpi.com/2076-3417/11/20/9702

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