Integrated Platform for Determining Solderability Parameters: Module for Measuring the Surface Tension of Liquid Solders
Abstract
:1. Introduction
2. Maximum Bubble Pressure Method
2.1. Analysis of Surface Tension Using the Maximum Bubble Pressure Method
- —Pressure in the bubble (for practical purposes, this does not depend on point A).
- —Pressure in the retort above the bath surface (does not depend on point A).
- —Hydrostatic pressure (a function of the depth h relative to the bath surface).
- —Density of the bath material.
- g—Acceleration due to gravity.
- —Depth of immersion of point A in the bath.
- h—Capillary immersion depth.
- r—Capillary radius.
2.2. Introduction of Measurement Correction
- —The value of surface tension determined from (9).
- —The adjusted value.
3. Construction Concept and Construction of the Measuring Platform
3.1. IT System Architecture
3.2. Experimental Scheme
3.3. Module for Measuring the Surface Tension of Liquid Solders: Construction
4. Results of the Experiment
5. Discussion
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
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Parameter | Value |
---|---|
Temperature | 250 [°C] |
Capillary material | Al2O3 |
Surface activation time | 60 [s] |
Sample immersion time | 120 [s] |
Sample Standstill Time After Experiment | 30 [s] |
Immersion depth | 6 [mm] |
Capillary diameter | 3 [mm] |
Crucible Filling | S-Sn97Cu3 |
Solder Density | 7300 [kg/m3] |
Parameter | Value |
---|---|
Maximum Pressure | 11.83 [mbar] |
Surface tension | 565.55 [mN/m] |
Corrected surface tension | 458.13 [mN/m] |
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Bąkała, M.; Błaszczyk, P. Integrated Platform for Determining Solderability Parameters: Module for Measuring the Surface Tension of Liquid Solders. Appl. Sci. 2024, 14, 7730. https://doi.org/10.3390/app14177730
Bąkała M, Błaszczyk P. Integrated Platform for Determining Solderability Parameters: Module for Measuring the Surface Tension of Liquid Solders. Applied Sciences. 2024; 14(17):7730. https://doi.org/10.3390/app14177730
Chicago/Turabian StyleBąkała, Marcin, and Piotr Błaszczyk. 2024. "Integrated Platform for Determining Solderability Parameters: Module for Measuring the Surface Tension of Liquid Solders" Applied Sciences 14, no. 17: 7730. https://doi.org/10.3390/app14177730