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Journal: Appl. Sci., 2025
Volume: 15
Number: 9847

Article: The Impact of Process Variations on the Thermo-Mechanical Behavior of 3D Integrated Circuits
Authors: by Yi-Cheng Chan, Ming-Han Liao and Chun-Wei Yao
Link: https://www.mdpi.com/2076-3417/15/17/9847

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