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Journal: Appl. Sci., 2019
Volume: 9
Number: 3476

Article: Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach
Authors: by Hiroaki Tatsumi, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba and Akio Hirose
Link: https://www.mdpi.com/2076-3417/9/17/3476

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