3.1. Studies of Monolayer HfO2 Film
In the process of optical film preparation, substrate temperature, ion source bias, background vacuum, oxygenation, and deposition rate are the key factors affecting the film quality [
12]. Among them, the substrate temperature affects the migration rate of the film material molecules, thereby affecting the degree of bonding between the film and the substrate [
13]. Therefore, the effect of substrate temperature on the deposition of HfO
2 monolayer film was investigated including the relationship between the crystallization, refractive index, surface roughness, and substrate temperature.
The structure of the film was measured using an X-ray diffractometer of the SmartLab model produced by Rigaku. The XRD results of HfO
2 films deposited at different temperatures are shown in
Figure 2. When the temperature is lower than 180 °C, no obvious diffraction peak appears, indicating that the film is amorphous. As the temperature further increases, the diffraction peaks intensity of the HfO
2 film gradually increase, indicating that the film gradually changes from amorphous to crystalline, and the film exhibits a preferred crystal orientation at the (020) diffraction peak with a diffraction angle of 34.6° and the (−111) diffraction peak with a diffraction angle of 28.3°.
The transmittance of HfO
2 films deposited at different substrate temperatures was measured using a UV-visible spectrophotometer, as shown in
Figure 3a. According to the transmittance spectrum curve, the refractive index of the HfO
2 film was calculated by MCalc software. The refractive index and packing density of HfO
2 films under different substrate temperature are shown in
Table S2. As shown in
Figure 3b, the refractive index of the film at 575 nm increases with the increase of temperature. When the temperature is higher than 210 °C, the refractive index does not change significantly, and the refractive index at 575 nm is about 2.08.
The surface shape of the substrate was measured by a laser interferometer. The light source wavelength of the interferometer is 632.8 nm.
Figure S1 shows the surface shape test diagram of the coated BK7 substrate at different temperatures and the uncoated BK7 substrate. According to the surface shape results, the root mean square (RMS) and peak–valley difference (PV) of the surface roughness of HfO
2 films at different temperatures were analyzed, and the results are shown in
Figure 4. When the temperature increases from 120 °C to 240 °C, the RMS value has a minimum value of 0.05514λ at 180 °C and a maximum value of 0.14948λ at 240 °C. In general, the RMS values of HfO
2 films at different substrate temperatures are small and the surface morphology is uniform.
When the temperature increases from 120 °C to 180 °C, the PV value decreases with increasing temperature and with a minimum value of 0.24813λ at 180 °C. This is due to the increased migration of particles on the substrate surface with increasing temperature, which increases the densities of the film and the bonding ability of the film to the substrate, resulting in a smoother and less defective film surface [
14]. In addition, the residual stress between the film and the substrate is low in this temperature range, which also results in lower PV. However, when the temperature increases from 180 °C to 240 °C, the PV increases with temperature, with a maximum value of 1.18894λ at 240 °C. This is because the continued increase in temperature leads to an increase in the bombardment of the substrate by the film molecules, and some film molecules even enter the interior of the substrate because of the rapid migration rate, which causes the surface structure of the film to be inhomogeneous and the defects to increase [
15]. In addition, the high temperature also increases the residual stress between the film and the substrate and may lead to problems such as localized peeling of the film on the substrate surface [
16].
Considering the results of XRD, spectral and surface shape results, a substrate temperature of 180 °C was used for coating in this paper, and the deposition process parameters of the resonant cavity film are shown in
Table 3.
3.2. Theoretical Design of Resonant Cavity Film
Multilayers can be considered as a superposition of monolayers. Therefore, the calculation of the electromagnetic field behavior of multilayers can be understood as the whole set of film matrices being the product of its each monolayers [
17].
The multilayer interface of a multilayer membrane can be expressed as an equivalent interface with the optical conductance
Y of the membrane surface.
If the film layer system has absorption, the absorption rate can still be deduced from Equation (4). Assuming that neither the incident dielectric nor the substrate has absorption, the light intensity I of the light wave arriving at the
k interface is
* indicates conjugate complex numbers.
The actual intensity of the light waves entering the membrane system is
The reflectivity of the film system is set as
R, then the actual light intensity entering the film system is equal to (1 −
R)
I0, where
I0 is the intensity of incident light. Next, we compare these two equations to obtain
According to the law of conservation of energy it is then obtained that the absorption rate
A is
In addition, from the transmittance a of the monolayer
The reflectance
R and transmittance
T of the membrane system can also be deduced respectively as
The theoretical film system design of resonant cavity film was carried out using TFCalc film system design software. The resonant cavity film A requires high transmission in the 345~460 nm band and high reflection in the 540~620 nm band. For this index, a short wavelength pass can be used as the base film system, set as Sub|(0.5LH0.5L)^S|Air, where S is the number of repetition cycles of the film stack, Sub is JGS1 fused silica, H is HfO2 with an optical thickness of 1/4 reference wavelength, and L is UV-SiO2 with an optical thickness of 1/4 reference wavelength. The requirement of cutoff in the reflective region is achieved by adjusting the number of repetition cycles S. When S ≥ 25, a high cutoff is obtained in the highly reflection region and a higher transparency is available in the highly transmissive region. After that, with the increase of the repetition number, the cutoff degree of the reflection region and the transparency of the transmittance region do not change significantly. Under the condition of meeting the technical parameters, the number of layers of the short wave pass film system should be as few as possible. The initial film system is set as Sub|(0.5LH0.5H)^25|Air, the reference wavelength is 570 nm.
According to the technical parameters, the optimized continuous target was set in TFCalc software. The final film system was Sub|1.2160H 0.8903L 1.2012H· ·1.2486L 0.7505H 0.6234L|Air, with a total of 50 layers and a physical thickness of about 4.217 μm. Each film layer physical thickness of resonant cavity film A is shown in
Table S3. The initial and the theoretical transmittance spectral curve of the resonant cavity film A is shown in
Figure 5. It can be seen from the theoretical transmittance spectrum that the average transmittance of 345~460 nm band is 99.5328%, and the average reflectance of 540~620 nm band is 99.9368%, which meets the requirements of technical parameters.
The resonant cavity film B requires high reflection in the 345~460 nm band, transmittance T = 1% in the 540~620 nm band, and multiple high reflection film systems q((HL)^S H) need to be introduced for superposition, where q is the film stack coefficient, and S is the number of repetition cycles of the film stack. The film stack coefficient and the number of cycles of the basic film system are determined according to the reflection bandwidth and reference wavelength of the film system. The initial film system was set as Sub|0.75((HL)^10 H) 0.83L 0.91((HL)^12 H) 1.07L 1.23((HL)^8 H)|Air, with the reference wavelength of 470 nm.
According to the technical parameters, the optimization target was set, and the optimized film system was Sub|0.7142H 0.6986L 0.7482H 0.8190L · · ·1.5647L 1.7563H 1.0586L 1.3936H|Air, with a total of 71 layers and a physical thickness of about 4.826 μm. Each film layer physical thickness of resonant cavity film B is shown in
Table S4. The initial and the theoretical transmittance spectral curve of the resonant cavity film B are shown in
Figure 6. It can be seen from the theoretical transmittance spectrum that the average reflectance of the 345~460 nm band is 99.9106%, and the average transmittance of the 540~620 nm band is 1.0174%, which meets the requirements of technical parameters.
In order to ensure that the pump light is input with high transmittance and the yellow laser is output with partial transmittance, a 330~650 nm antireflective film needs to be coated on the input mirror and the output mirror. The design scheme of the antireflective film was Sub|0.1558H 0.6749L 0.2223H 2.1507L 0.3158H 0.1299L 1.4884H 0.9055L|Air, with a total of 8 layers, a reference wavelength of 240 nm, and a physical thickness of about 0.43 μm. The development process of antireflective film is no longer described in detail due to the relatively simple design of antireflective film and a few numbers of layers. The theoretical and measured transmittance curves of the antireflective film are shown in
Figure S2. The theoretical average transmittance of film was 99.5080% in the 330~650 nm band, and the measured average transmittance was 95.76%. Since the exit medium of the film was air during the process of transmittance testing, there was a partial loss of the tested transmittance.
The film systems of the resonant cavity film A, resonant cavity film B, and the antireflective film were imported into the TFCalc software, and the theoretical transmittance curves of the input mirror and the output mirror were obtained as shown in
Figure 7. The average transmittance of the input mirror was 99.6246% in the 345~460 nm band and the average reflectance was 99.9369% in the 540~620 nm band. The average reflectance of the output mirror was 99.9378% in the 345~460 nm band and the average transmittance was 1.0378% in the 540~620 nm band.
3.3. Analysis of Quartz Crystal and Optical Control Solutions
Current methods of film thickness monitoring include quartz crystal monitoring and optical monitoring [
18]. Quartz crystal monitoring can provide the deposition rate of the film layer. However, as the thickness of the film layer increases, the accuracy of the quartz crystal oscillation frequency decreases and the error increases. Especially for highly sensitive film layers, a small error may have a serious impact. Therefore, timely switching of the crystal control chip is required [
19]. The optical monitoring method measures the optical thickness of the film and has a compensation mechanism for the film thickness error. However, it is difficult to monitor the deposition rate of the film [
20]. Therefore, in order to overcome the drawbacks of each of the quartz crystal control and optical control methods, a film thickness monitoring method that combines the crystal control and optical control methods was used to monitor the film thickness of the resonant cavity film in this work [
21].
The first-order film layer sensitivity and second-order film layer sensitivity of the resonant cavity film A are shown in
Figure 8a,b. The crystal switching position is set according to the film layer thickness and film layer sensitivity. When preparing resonant cavity film A, six quartz crystal control chips were used to monitor 1~6, 7~15, 16~23, 24~30, 31~38, and 39~50 layers, respectively. The quartz crystal control chip monitoring scheme of the resonant cavity film A is shown in
Figure 9a.
The first-order film layer sensitivity and second-order film layer sensitivity of the resonant cavity film B are shown in
Figure 8c,d. For resonant cavity film B, six quartz crystal control chips were used to monitor 1~14, 15~30, 31~42, 43~52, 53~64, and 65~71 layers, respectively. The quartz crystal control chip monitoring scheme of the resonant cavity film B is shown in
Figure 9b.
The design was imported into the MCalc software, and the number of optical control pieces, monitoring wavelength, and other parameters were optimized to determine the optimum monitoring scheme. The number of optical controllers should be as few as possible for the premise of meeting the monitoring requirements to reduce the accumulation of residual errors caused by switching optical controllers during the film deposition process.
Figure 10 shows the variation curves of transmitted light signal intensity with thickness for film layers A and B. It can be observed that the alternating points of HfO
2 film (blue curve) and SiO
2 film (green curve) are located in the non-extreme values of the optical signal variation curves. At this point, the optical signal is sensitive to changes in the thickness of the film layer, and it is easy to accurately control the thickness of the film layer.
Combined with the sensitivity analysis of the resonant cavity film A, when the number of optical control pieces was lower than 3, it was impossible to find a monitoring scheme where the error of each layer can be controlled at 1%. Therefore, the number of optical control pieces in the monitoring scheme was determined to be 3. The 1
# optical control chip monitored the 1st to 14th layers, 2
# optical control chip monitored the 15th to 26th layers, and 3
# optical control chip monitored the 27th to 50th layers. The monitoring wavelengths of the optical control chips were 435 nm, 443 nm, and 486 nm, respectively. The optical signal changing with thickness is shown in
Figure 10a–c.
Similarly, combined with the sensitivity analysis of the resonant cavity film B, the number of optical control pieces in the monitoring scheme was determined to be 3. The 1
# optical control chip monitored the 1st to 20th layers, 2
# optical control chip monitored the 21st to 44th layers, and 3
# optical control chip monitored the 45th to 71st layers. The monitoring wavelengths of the optical control chips were 438 nm, 490 nm, and 436 nm, respectively. The optical signal changing with thickness is shown in
Figure 10d–f.
3.4. Test and Analysis of Resonate Cavity Film
The cross-sectional morphology of resonant cavity film A and film B was tested by ultra-high-resolution field-emission scanning electron microscopy (SEM). The SEM results are shown in
Figure 11. It can be observed that both the resonant cavity film A and resonant cavity film B have densely arranged lamellar structures. The physical thickness of the resonant cavity film A is 4.209 μm, and the relative error with the theoretical physical thickness is 0.24%. The physical thickness of the resonant cavity film B is 4.838 μm, and the relative error with the theoretical design physical thickness is 0.18%.
The transmittance of the input and the output mirror after the deposition of the antireflective films is shown in
Figure 12. The results show that the average transmittance of the input mirror in the 345~460 nm band is 98.61% and the average reflectance in the 540~620 nm band is 99.61%. The average reflectance of the output mirror in the 345~460 nm band is 99.74%, and the average transmittance in the 540~620 nm band is 1.06%. The actual spectrum results meet the theoretical design requirements.
After the input and output mirrors of the resonant cavity were completed with the film preparation, surface shape tests were performed as shown in
Figure 13. The measured PV values for the input mirror and output mirror were 0.36071λ and 0.79648λ, respectively, and the RMS values were 0.08988λ and 0.11702λ, respectively. Compared with the HfO
2 single-layer film, the resonant cavity film prepared based on both HfO
2 and UV-SiO
2 materials has an increased number of layers, and the residual stress between the film layers will be larger. As a result, the microscopic morphology of the multilayer film is more inhomogeneous compared with the monolayer film, and the deformation and surface roughness will be higher than that of the monolayer film. Nevertheless, the PV and RMS values meet the requirements.
A Dy,Tb:LuLiF
4 crystal with dimensions of 3 × 3 × 25 mm
3 was placed in a resonant cavity consisting of an input mirror and an output mirror to complete the construction of the optical path system. In this work, the pump source was a laser with a central wavelength of 450 nm and a fiber diameter of 500 μm. The spectrum and the power of the output laser were measured by a high-resolution spectrometer and a laser power meter, respectively. The laser output results are shown in
Figure 14. It can be seen that the plated resonant cavity films were used to couple and match the Dy,Tb:LuLiF
4 crystal successfully, causing an excited radiation leap in the crystal, thereby outputting a 575 nm yellow laser with the output power of 106 mW.