Ma, W.; Zheng, Y.; Luo, C.; Feng, T.; Dong, G.; Gao, H.; La, P.
Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters. Coatings 2025, 15, 521.
https://doi.org/10.3390/coatings15050521
AMA Style
Ma W, Zheng Y, Luo C, Feng T, Dong G, Gao H, La P.
Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters. Coatings. 2025; 15(5):521.
https://doi.org/10.3390/coatings15050521
Chicago/Turabian Style
Ma, Wenwen, Yuehong Zheng, Chong Luo, Tao Feng, Gang Dong, Haoyang Gao, and Peiqing La.
2025. "Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters" Coatings 15, no. 5: 521.
https://doi.org/10.3390/coatings15050521
APA Style
Ma, W., Zheng, Y., Luo, C., Feng, T., Dong, G., Gao, H., & La, P.
(2025). Regulation of Microstructure and Mechanical Properties of DC Electrodeposited Copper Foils by Electrolyte Parameters. Coatings, 15(5), 521.
https://doi.org/10.3390/coatings15050521