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Journal: Coatings, 2018
Volume: 8
Number: 401
Article:
A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers
Authors:
by
Cherng-Yuh Su, Jia-Liang Huang, Po-Chun Chen, Hsin-Jung Yu, Dai-Liang Ma and Bang-Ying Yu
Link:
https://www.mdpi.com/2079-6412/8/11/401
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