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Journal: Electronics, 2022
Volume: 11
Number: 2556

Article: Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock
Authors: by Shuai Zhou, Zhenpei Lin, Baojun Qiu, Han Wang, Jingang Xiong, Chang He, Bei Zhou, Yiliang Pan, Renbin Huang, Yiliang Bao and Nian Cai
Link: https://www.mdpi.com/2079-9292/11/16/2556

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