Importance of Solvent Evaporation Temperature in Pre-Annealing Stage for Solution-Processed Zinc Tin Oxide Thin-Film Transistors
Round 1
Reviewer 1 Report
There is a need to present details of the Ts process -- other parts of the flow are described in detail, but the pre-anneal description does not include equipment or atmosphere.
Results are interesting supporting the conclusion that Ts impacts the morphology and the performance. The explanations could be improved to provide stronger support to conclusions on mechanisms.
The paper would be stronger because of limited experimental variations. It appears that there are many factors in the pre-annealing that could impact the performance that were not explored -- ramp rate, atmosphere composition and temperature and pressure.
The paper would benefit if it could provide a stronger conclusion -- it would be better if it could make a recommendation on optimal Ts, not just that results depend on Ts.
Paper would be better if it could provide comparison data for IGZO and ZTO parts produced using vacuum deposition.
Author Response
Please see the attachment.
Author Response File: 
Author Response.pdf
Reviewer 2 Report
This paper presents the well-composed concept of the pre-annealing stage on solution-processed zinc tin oxide thin-film transistors.
Such a topic is fascinating in the applications because of the huge progress in this field, but a great disparity remains from material fabrication to practical applications due to the high material tension and unavoidable losses for low-energy electronics.
Review of Literature:
The author cited a properly composed review of the literature, and a lot of appropriate references were used in the introduction section. These statements contributed generously to the overall understanding of the subject and the reasoning for thorough analysis and optimal design of the residual organic defects effectively removed in increasing pre-annealing stage in solution-processed zinc tin oxide which is very important for ensuring reliable and safe operation.
Methodology:
The general methodology and description are well prepared. The action plan is clearly defined and well thought out except for the unpredictable time to iteratively improve individual modeling and measurement methods. The investigation methods and techniques used to gather the data for this article have been adequately selected, justified, and finally clearly discussed and concluded. However, the AFM three-dimensional image measurement techniques were explained, but the reliability coefficients of all possible tests were not given, and no discussion of the statistical methods was presented in this particular section.
Findings and conclusions
The findings were well organized, sectioned, and reported objectively. The charts were well presented, but the difficulty of the statistical tests employed would not be stand-alone to the average reader.
A solid point of the article is the high feasibility of using the reported issues’ results. The presented concept of applying the better material resulting from the conducted experiment is feasible and valuable for the electronics industry.
Language:
The English is almost perfect; I have not found only some mistakes in the language that need corrections – for example:
Line 57:
“similar temperature” The noun phrase similar temperature seems to be missing a determiner before it. Consider adding an article.
Line 98:
“in air” The noun phrase in air seems to be missing a determiner before it. Consider adding an article.
Line 125:
“and deteriorate stability” It seems that this noun form may be incorrect (>deteriorated)
Author Response
Please see the attachment
Author Response File: Author Response.pdf
