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Journal: Electronics, 2023
Volume: 12
Number: 2385

Article: Sidewall Modification Process for Trench Silicon Power Devices
Authors: by Lei Jin, Zhuorui Tang, Long Chen, Guijiu Xie, Zhanglong Chen, Wei Wei, Jianghua Fan, Xiaoliang Gong and Ming Zhang
Link: https://www.mdpi.com/2079-9292/12/11/2385

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