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Journal: Electronics, 2023
Volume: 12
Number: 2877

Article: Highly Integrated Ka-Band Multi-Beam Network Design Based on a Low-Cost Multi-Layer Printed Circuit Board
Authors: by Xiao Yang Zhang, Jun Yang, Bo Zhang, Yan Li, Ruo Xin Li, Xu Rong Qin and Mao Long
Link: https://www.mdpi.com/2079-9292/12/13/2877

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