Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Round 1

Reviewer 1 Report

High-precision and reliable manufacturing of ultra-thin devices is a hot-spot field. The development of adhesives and debonding process are critical for the size breakthrough of ultra-thin devices. In this paper, authors focus on the recent progress of temporary bonding and debonding technology in advanced packaging. They point out the applicable situations and limitations of different temporary bonding materials and debonding technologies systematically. However, the mechanism study of these technologies has not been mentioned, and English skill for the native speaker is necessary. And English skills need to be improved. Therefore, I recommend the acceptance after a major revision.

 

1.      The Second-level and third-level headings are incorrectly numbered.

a)     Page 2: “1. Advances in TBDB technologies” should be “2. Advances in TBDB technologies”.

b)    Page 4: “2.3. Mechanical peel-off debonding” should be in be in italics “2.3. Mechanical peel-off debonding”.

c)     Page 7: “2.5. . Comparison” should be “2.5. Comparison”.

d)    Page 8: “1. Applications in Advanced packaging” should be “3. Applications in Advanced packaging”.

e)     Page 11: “3.3.2. D material transfer” should be “3.3. 2D material transfer”.

 

2.      Abstract Section: a) Abbreviations (TBDB) should be explained in detail, where it appears for the first time.

b) “TBDB technologies with vast application scenarios” should be “TBDB technologies and its vast application scenarios”.

 

3.     Fig.2. Main flow of temporary bonding/debonding, Page 3: What do the three arrows between "Thermal slide", "Chemical dissolution" and "Mechanical peeling" in Figure 2 mean? Please clarify it.

 

4.      Table 1, Page 8: The characters in Table 1 should be centered vertically.

 

5.      Fig.3. Chip-first (left) and chip-last (right) process flows, Page 9: Instead of “left” and “right”, figures should be numbered. “chip-first (left)” should be figure 3(a). “chip-last (right)” should be figure 3(b). Similarly, “Via-middle(left), via-last(middle) process of TSV processing and Cu-Cu bonding(right)” in Page 11 should also be numbered as “figure 4(a), figure 4(b) and figure 4(c)”.

 

6.      The purpose of this paper is to review the latest development and application of debonding in advanced packaging. The latest progress of debonding includes industrial technology and theoretical foundations. In Page 5, authors write “Especially when handling large or ultra-thin wafers such mechanical forces cannot be ignored, as this increases the risk of their breakage”. In Page 7, authors write “Thermal slide debonding releases the wafer by applying a slip force to wafer at specific high temperature, which means that the wafer necessarily suffers an additional risk of chipping caused by the mechanical stress”. It will be useful to add some details to the stress and breakage of adhesive ultra-thin devices. Thus, the author should consider whether it is necessary to review the mechanism study of adhesive ultra-thin devices while peeling off? If necessary, please supplement the theoretical research progress.

 

7.      The English usage needs significant corrections in almost all sections, such as

a)     Page 11: “By temporarily bonding the chips to be processed on different carriers, and then aligning and connecting the chips” should be “By temporarily bonding the chips to be processed on different carriers, aligning and connecting the chips”.

b)    Page 11: “has shown great properties like high carrier mobility” should be “has shown great properties, such as high carrier mobility”.

c)     Page 12: “Faced with the vigorous development of optoelectronic devices today” should be “With the vigorous development of optoelectronic devices today”.

d)    Page 14: “contributed to the resources, supervision, funding acquisition” should be “contributed to the resources, supervision and funding acquisition”.

Please check the full text of the manuscript.

 

8.      References Section: For the sake of consistency, citation format of the references needs to be standardized, for example

a)     In Ref. [1]-[83], please use either full or abbreviated journal name in References, instead of a mix of these two formats.

b)    In Ref. [3], Ref. [10], Ref. [16], Ref. [23], Ref. [38], et al., the markups of page numbers are inconsistent, please proofread.

c)     In Ref. [25], abbreviations of Journal name in parenthesis should be capitalized.

d)    In Ref. [29], Ref. [32] and Ref. [44], the address appears repeatedly.

e)     In Ref. [29], Ref. [32] and Ref. [44], article titles should not be presented entirely in caps.

The above are only part of the formatting issues about the references, please check the full text of the manuscript.

 

Author Response

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Author Response File: Author Response.pdf

Reviewer 2 Report

The authors' review on bonding technologies in advanced packaging is well-organized and technically sound. However, to improve the paper's quality, it is recommended that they include a more comprehensive description of the literature review, including photographs of previous works. Additionally, the authors should discuss the previous works summarized in Table 2 to provide more context and clarity to the reader.

Author Response

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Author Response File: Author Response.pdf

Reviewer 3 Report

This review paper's topic is indeed very interesting, and can be a good sources for several groups of scientists and engineers, in my opinion. The review paper, however, should be rewritten and the content should be improved. Here are my comments & suggestions for the authors

1) The images are all schematics; however, real SEM/TEM cross-sectional images are not included. The image of bonded stacks will be valuable for a comprehensive review paper.

2) There is no information regarding the tools, such as the suppliers of laser debonders and mechanical peeling.

3) The extensive citation to the names of firms with corporate endings in capital letters is something that visually hurts the eyes to read in the paper. One of the examples is "shiojjima etal from SEKISUI CHEMICALS CO. LTD." on page 7. There is no need to write the entire company name, which would take up half of the line. Move everything to the reference or only mention one indicator from that work, such as Sekisui or Shiojjima etal.

4) On page 7, what is the tribble layer? Shouldn't it be tripple?

5) At the center of page 5, "thinned from 585 µm to 29 µm with??? TTV! The value is absent.

6) The manuscript contains numerous typos and inaccuracies. Please read through the text again. For example, on page 5 line 6, Brewerbond 305 appears twice.

7) Make a sub-chapter on perforated wafer fabrication, how doese it look like and what are the the essential factors in developing or pruchasing a perforated wafer.

8) Include Laser Lift-off technology from Disco in your debonding technology as well as  NanoCleave from EVG

9) How about a comparison of bonding and debonding processing times as well as speed?

10) In the introduction, you may include a table comparing permanent adhesive bonding to temporary adhesive bonding and how the two differ chemically.

11) Another topic to be included is cross-contamination of TSVs specially not-filled TSVs with adhesives. please mention that as well and state the approaches suggested for instance by Brewer, etc. 

 

Author Response

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Author Response File: Author Response.pdf

Round 2

Reviewer 1 Report

The authors have addressed all my concerns.

Author Response

Thank you for your review

Reviewer 2 Report

Thank you for considering reviewer's comments.

Author Response

Thank you for your review.

Reviewer 3 Report

The authors made an effort to resolve all of the concerns expressed by the reviews. Nonetheless, there were some misunderstandings regarding some of the questions, which appeared to have a negative impact on the paper. My comments for the second review is as follows:
1) The point 7 in the first revision for perforated wafers was understood wrongly for TSV. I meant perforated wafer shape (size of holes, distribution of holes for better chemical flow) for chemical dissolution technique. Please remove Figure 7 and all the added text for hole fabrication added in review.

2) Similarly, for point 11, I meant the contamination coming from the temporary adhesives that remained in the TSVs, and not the side-effects of the Bosch process. Please also remove this part. 

3) Please remove Figs. 3 and 4, since they are marketing pictures for Disco and EVG. You can also summarize the corresponding techniques in a single paragraph.

4) Concerning point 4 please only refer to adhesive permanent bonding and not other methods like direct Si-Si bonding. Please compare typical bond energy of permanent and temporary adhesives. BTW. What is hot-press bonding? you mean thermocompression?

Additionaly:

5) page 3, the last paragraph, "are" is extra in "is bonded to ....the device wafer are"

6) Figure 2: The white (yellow) layer on the device wafer is the release layer? Please indicate in the text or picture what the pink and white layer is.

 

 

 

Author Response

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Author Response File: Author Response.docx

Round 3

Reviewer 3 Report

The revised version can be accepted.