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Journal: Electronics, 2024
Volume: 13
Number: 2188
Article:
Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach
Authors:
by
Omid Alavi, Ward De Ceuninck and Michaël Daenen
Link:
https://www.mdpi.com/2079-9292/13/11/2188
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