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Electronics2024, 13(21), 4275;https://doi.org/10.3390/electronics13214275

Journal: ElectronicsVolume: 13Number: 4275

Article: Predicting Work-in-Process in Semiconductor Packaging Using Neural Networks: Technical Evaluation and Future Applications

Authors:
Chin-Ta Wu^1,2,
Shing-Han Li^3,* and
David C. Yen⁴

Link: https://www.mdpi.com/2079-9292/13/21/4275

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