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Article

Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices

by
Chin-Wen Liao
1,
Hsiu-Chou Yu
1 and
Yu-Cheng Liao
1,2,*
1
Department of Industrial Education and Technology, National Changhua University of Education, Changhua City 50007, Taiwan
2
Cisco Systems, Inc., 300 East Tasman Dr., San Jose, CA 95134, USA
*
Author to whom correspondence should be addressed.
Electronics 2025, 14(5), 837; https://doi.org/10.3390/electronics14050837
Submission received: 2 January 2025 / Revised: 18 February 2025 / Accepted: 19 February 2025 / Published: 20 February 2025

Abstract

The Serial Peripheral Interface (SPI) protocol plays a crucial role in wearable and IoT devices, enabling high-speed communication between microcontrollers and peripherals such as sensors, displays, and connectivity modules. With the increasing complexity of modern devices and system-on-chip (SoC) designs, robust verification methods are essential to ensure functionality and reliability. This paper utilizes the Universal Verification Methodology (UVM) to develop a scalable and reusable testbench for SPI verification. The process encompasses test planning, simulation, emulation, and top-level verification to validate multi-slave coordination and error-handling scenarios. The results demonstrate the critical importance of UVM in ensuring the performance and dependability of SPI in advanced electronics, contributing to the reliable integration of the protocol in future devices. The verification results demonstrated a functional coverage of 83.33% and 100% assertion coverage, confirming our approach’s robustness. Analysis of the uncovered functional bins revealed that specific edge cases, such as timing violations and multi-slave arbitration conflicts, require additional test scenarios for full verification. Furthermore, our testbench successfully identified and handled critical fault conditions, such as clock jitter, bus contention, and framing errors, ensuring reliable SPI operation in real-world deployments. These findings highlight the effectiveness of UVM-based verification in improving the reliability and robustness of SPI communication in modern low-power, resource-constrained embedded systems.
Keywords: serial peripheral interface; universal verification methodology; functional verification; constrained random testing; coverage-driven verification; SoC validation; IoT communication interfaces; assertion-based verification serial peripheral interface; universal verification methodology; functional verification; constrained random testing; coverage-driven verification; SoC validation; IoT communication interfaces; assertion-based verification

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MDPI and ACS Style

Liao, C.-W.; Yu, H.-C.; Liao, Y.-C. Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices. Electronics 2025, 14, 837. https://doi.org/10.3390/electronics14050837

AMA Style

Liao C-W, Yu H-C, Liao Y-C. Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices. Electronics. 2025; 14(5):837. https://doi.org/10.3390/electronics14050837

Chicago/Turabian Style

Liao, Chin-Wen, Hsiu-Chou Yu, and Yu-Cheng Liao. 2025. "Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices" Electronics 14, no. 5: 837. https://doi.org/10.3390/electronics14050837

APA Style

Liao, C.-W., Yu, H.-C., & Liao, Y.-C. (2025). Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices. Electronics, 14(5), 837. https://doi.org/10.3390/electronics14050837

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