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Journal: Aerospace, 2018
Volume: 5
Number: 74

Article: Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review
Authors: by Ephraim Suhir and Reza Ghaffarian
Link: https://www.mdpi.com/2226-4310/5/3/74

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