1. Introduction
Recently, the demand for hard and brittle materials, including Zirconia (ZrO
2) and BK7 glass, has increased significantly, capturing heightened attention [
1,
2,
3]. This interest is attributed to their desirable mechanical properties, such as their high bending strength, metallic luster, effective conductivity, elevated hardness, robust corrosion resistance, substantial modulus of elasticity, superior resistance to crack propagation, and minimal thermal expansion [
4,
5]. The exceptional qualities of Zirconia have led to its widespread use in precision applications, particularly in the fields of medical implants and cell phone bodies [
6]. The material’s aesthetic appeal, exceptional hardness surpassing that of glass or plastic, near-complete resistance to corrosion, ability to be highly polished after shaping, and lighter weight compared to metals are not its only advantages [
6]. Additionally, it facilitates the easy penetration of radio waves, resulting in stronger signals for Wi-Fi, LTE, or Bluetooth without the need for lengthy antenna cutouts [
6]. Unfortunately, the hard and brittle properties of Zirconia ceramics have redoubled the machining difficulties used in these applications, and surface finishing and accuracy are of the utmost importance [
7,
8]. The grinding process is almost the only suitable process to duly machine Zirconia and is the proficient choice for machining hard and brittle ceramics [
9]. The grinding wheel generates a small cutting force because the grinding wheel employs many small cutting edges instead of one or a few large cutting edges like those used in milling. However, the small cutting edges cause dramatic forces that mitigate crack propagation in grinding. Optimal control of the grinding conditions can effectively mitigate subsurface damage. The grinding process is primarily influenced by elements like the grinding feed rate, grinding wheel velocity, depth of cut, tool size, qualities of the workpiece, and grinding wheel. Among these factors, the grinding force is the most crucial determinant [
8,
10]. In order to effectively reduce the surface and sub-surface damage in the surface grinding process, the grinding force during processing should be identified before the actual machining [
11]. Therefore, building an arithmetical model of the cutting force in the grinding process depending on the material and mechanical properties and grinding factors is indispensable [
12] in order to explore the mechanism of grinding and prognosticate the grinding process [
13]. As a result, studying the control of the grinding force model at an in-depth level is paramount in the grinding of brittle and hard materials [
14], as it can ensure optimum surface and subsurface integrity and enhance the efficiency of machining at the same time [
15].
Contemporary studies in grinding focus on the interaction between the workpiece and the grain edges, which in turn evolves the grinding forces [
16]. Accordingly, a lot of research has been conducted to improve arithmetical models of grinding forces by considering the cutting force as a reaction between the grain of the grinding wheel and the workpiece. For instance, Zhang et al. [
17] presented a theoretical model for the force of surface grinding depending on the mechanisms of material elimination and ductile accumulation and considering the effect of the lubrication conditions; moreover, they investigated the component of the frictional force by adding the cutting face to the grain wear plane. Bingyao Zhao et al. [
18] used an extended finite element method to construct a model correlating the prefabricated crack depth with the final crack depth. This model elucidates the impact of diverse subsurface damages on the propagation of cracks. Li et al. [
19] created a theoretical model of grinding force considering that the grinding force is acquired through the following three cutting stages between the grits and workpiece: rubbing, ploughing, and cutting stages. This model can provide a detailed understanding of the representation of the grinding force at the microscale. Wang et al. [
20] developed a model for predicting the grinding force in multi-grain abrasive operations. This model facilitates the accurate prediction of grinding force, thereby reducing the error between theoretical and experimental values. Cheng et al. [
21] developed three different orientations in micro-slot grinding for predicting the grinding force on single cutting grain from the wheel surface topography. This model canceled the effects of the mechanical properties of the grinding tool in modeling the grinding force. Chengzu Ren et al. [
22] established a grinding force model for electrolytic in-process dressing (ELID) groove grinding, augmented by an arc-track feeding unit. The modeling process entailed the determination of swing speeds, swing angles, and duty ratios of the arc-track feeding unit, serving as foundational elements for predicting tangential and normal forces. Hui Fu et al. [
1] introduced a novel predictive model for surface roughness (Ra) in silicon nitride ceramics grinding, leveraging the dynamic grinding force model. In a study by Longxu Yao et al. [
23], the mechanical properties of a 2.5D woven SiO
2f/SiO
2 ceramic matrix composite were assessed utilizing the stiffness averaging method. Additionally, a theoretical predictive model was formulated for the axial and transverse components of the grinding force in rotary ultrasonic elliptical grinding (RUEG) of the 2.5D SiO
2f/SiO
2 composite.
Many studies have been conducted that consider the effect of the brittle removal regime in the grinding force model without also considering the influence of the ductile removal mode. For instance, Binhua Gao et al. [
24] formulated an innovative analytical force model that incorporates the actual wheel-workpiece contact geometry (WWCG). In the modeling procedure, the cup grinding wheel is segmented into numerous micro-cutting layers along the wheel axis, and expressions for geometrical–kinematic parameters were derived to delineate material removal across various positions within the primary grinding zone (PGZ). Liu et al. [
25] derived a model, based on Vickers indentation theory, for the machining force in ultrasonic rotary machining of brittle materials, in which it was determined that the brittle rip of material removal is the main mechanism. Li et al. [
26] used the Hertz contact theory to calculate the a
c-cut for SiC ceramics at the transition point from the elastic to plastic region while relying on AFM and SEM during the transference from the brittle to ductile phase. However, the force models have neglected the influence of the ductile regime and the frictional force.
Furthermore, Yang et al. [
27] experimentally verified a force model based on a single abrasive grit scratch trial. This study mainly concentrated on optimizing the parameters of the grinding process according to tangential UVAG, whereas the frictional effects were ignored in this work. Gan Li et al. [
28] established a flow stress model for a tungsten-heavy alloy (WHA) that considered strain hardening, strain rate hardening, and thermal softening effects. This model facilitates comprehension of the variances induced by the disparity between the two phases during the grinding process, thereby furnishing a theoretical foundation for achieving efficient and minimally detrimental grinding of WHA and analogous composite materials. Li et al. [
29] considered the random allocation of abrasive and strain averages in an arithmetical model of grinding force; however, the model neglected the influence of brittle materials Sun et al. [
30] suggested an improved model for a grinding force that considered the grinding force in the ductile and fragile regions, and compliance of the friction force to both ductile and fragile modes, including the impacts of the friction process. Nevertheless, the model did not include the properties of the grinding tool material, and the ability of the unique grain to pass through the workpiece material, thereby varying the depth of the cuts.
Previous studies have shown that existing studies in the literature are insufficient in fully elucidating the effective removal and disposal of brittle materials during the grinding process. In light of this, the present investigation proposes an arithmetic model of machining force that takes into account the removal mechanisms of both ductile and brittle materials, frictional disposal, and that also considers factors such as the abrasive contact state and the random distribution of abrasive radii. Additionally, a novel technique is introduced to determine the slipping velocity of an individual grain and the dynamic contact line between the abrasive grit and the workpiece, while also addressing the limitations of the ac-max calculation, which is considered here for the first time.
Variations in grinding forces are contingent upon several factors: the material properties of the grinding tool, the effective contact length between the workpiece surface and the grinding tool, and the penetrative capability of the abrasive grit into the workpiece material. The thickness reduction function, denoted as ac-cr, is articulated in terms of the material properties, encompassing the modulus of elasticity, fracture toughness, and hardness of the material. Conversely, the maximum undeformed chip thickness, denoted as ac-max, is delineated based on the grinding parameters for two consecutive cutting grits. As a result, analytical models have been developed to ascertain the total grinding forces in both ductile and brittle removal modes, which correspond to the respective regions of ductile and brittle material removal mechanisms. This study presents a new method for analyzing the interaction between a single grinding grain and workpiece materials. Through the analysis of the contact and projection areas, parameters such as the contact length between the active grinding grains and the machined surface, as well as the cone angle of each individual grain, are considered. In addition, the study analyzes the frictional coefficient that arises from the interaction between the binder and workpiece surface, the grinding chip, and abrasion with the machined surface. In addition, the research examines the transition from the ductile to the brittle mode in hard and brittle materials and assesses the amount of active grinding grains that participate in the cutting action throughout the grinding process. This complete study offers a more in-depth comprehension of the intricate dynamics associated with material removal during grinding, hence facilitating enhanced efficiency and accuracy in machining processes.
3. Modeling of Grinding Force
The determination of the grinding force poses a significant challenge owing to the intricate interdependence among various arbitrary grinding factors associated with the grinding wheel. Consequently, the present investigation has chosen to concentrate on establishing the grinding force specifically for a solitary diamond grain. Simultaneously, Equation (13) serves to quantify the collective contribution of active grains engaged in the cutting process within the contact region during grinding, and can be expressed as follows:
where
Nd is the number of effective diamond grits,
is the abrasive concentration calculated as
,
aw is the grinding width, and
DG is the grain diameter.
The grinding force is identified as relative to (
n − t) axes. As mentioned in the previous section, the chip removal mechanism is categorized as a ductile stage and a combination of brittle and ductile stages. Consequently, the machining force is fundamentally and separately created out of the elastoplastic deformation through the ductile manner or combination of the elastoplastic deformation and brittle fracture. Equations (14) and (15) describe the components of the NT grinding forces, respectively, that portray the sources of the grinding force at the ductile stage:
where
is the overall force in the tangential coordinate,
is the tangential force in the contact plane due to the compression stress on the contact area,
is the friction force in the tangential plane,
is the aggregate force in the normal axis,
is the cutting force in the normal axis,
is the normal force acting on the contact plane due to the compression stress on the contact area, and
is the friction force acting on the normal direction.
The grinding force is a complex phenomenon owing to several challenges faced during the cutting process, such as the disconnection of ductile material, brittle fracture, and diffusion, as well as the slipping friction. As a result, machining forces can be categorized by gathering the ductile material removal component in the ductile cutting stage; the brittle fracture component in the brittle cutting stage; and the friction factor. Equations (16) and (17) are utilized to quantify the brittle grinding forces, as follows:
where
Ft-b is the brittle cutting force component in the tangential axis, and
Fn-b is the brittle cutting force component in the normal axis.
3.1. Grinding Force Model in Ductile Region
In the elastic removal within the ductile region, the material is removed by the particle forming uninterrupted chips generated through the rubbing and ploughing labor of the diamond grain [
41].
3.1.1. Cutting Force Equation Acting on the Cutting Area
The ability of the grinding wheel grain edges to pass through the workpiece material is one of the grinding forces that act in the UDCT of the elastic region. Equation (18) describes the cutting force model as expressed in
Figure 6a:
where
represents the amount of the compression yield stress of the workpiece at the touch area, which can be calculated by Equation (19) [
42], as follows:
where
A is a dimensionless constant taken as (
A = 1.5) for hard and brittle materials [
43]. Therefore, the resulting total cutting force directly acts on the cutting area due to the shearing force, as stated in Equation (20):
3.1.2. Normal and Tangential Contact Forces
According to
Figure 6b, the contact forces in the contact area are produced by the pressure of the grinding tool. Equations (21) and (22) simply classify the contact forces in both NT coordinates, respectively, as follows:
where
P is the pressure in the touch area that varies with the variation of the grain contact radius touched by the workpiece
Rc, and where
Rc is defined according to the UDCT. Subsequently, and based on Hertz’s theory, the pressure in the touch area is represented by Equation (23) [
44], as follows:
and the effective modulus of elasticity
is classified as [
45]:
where
,
are the elasticity modulus and Poisson’s ratio of workpiece material, respectively.
,
are the elasticity modulus and Poisson’s ratio of the diamond indenter material, respectively.
Rc is the contact radius between single grit and workpiece calculated in Equation (25) as follows:
Re is the effective curvature radius for a single grit calculated as:
By substituting Equations (24)–(26) into Equations (21) and (22),
Fn-ct and
Ft-ct can be classified as:
3.2. Grinding Force Model in Brittle Zone
In the brittle elimination zone, cracks are created and proliferated by a single grit in the dynamic touchline between the tool and the workpiece, clarifying that the fragile fracture governs the elementary abstraction mechanism. The grinding forces in the brittle phase are established relative to (
n − t) coordinates in Equations (29) and (30), respectively [
46], as follows:
As shown in
Figure 7,
Fmax represents the maximum contact force spent on the single grain via the maximum depth according to Hertz’s equation [
47],, where
µ is the friction coefficient. Thus, the maximum contact force is identified in Equation (31), as follows:
3.3. Frictional Force Model
In general, the abrasive frictional force is produced due to the rubbing among the abrasive grits and the surface of the workpiece materials [
48]. Based on Hertz’s theory [
47], the components of the frictional forces in (
n − t) coordinates are represented in the following equations [
30]. In the surface grinding of hard and brittle materials, the frictional effects are created due to two effects between the abrasives and the grinding surface. The first one is produced by the flux of the workpiece over the touch face, whereas the other one is generated by the friction between the wear protrusion of grits and the grinding face (see
Figure 8). The influence of grinding heat causes the coefficient of friction to vary with the varying conditions and behavior of the surface grinding. Therefore, modeling the coefficient of friction considering all these factors is a highly significant task.
5. Conclusions
The current study developed a mathematical model of the micro-grinding forces by providing a comprehensive analysis of the parameters influencing grinding for hard and brittle materials, specifically Zirconia ceramics (ZrO2) and Optical Glass (BK7). Through a detailed kinematic analysis of material removal, the research not only advanced the theoretical models but also substantiated them with empirical evidence, thereby bridging the gap between theoretical predictions and practical, experimental outcomes.
Key findings included the observation that material removal occurs via both ductile and brittle mechanisms, significantly influencing the grinding forces. This led to the theoretical model that effectively describes the grinding forces during these phases. The analysis showed that the normal grinding force is more significant than the tangential grinding force, and plays a crucial role in affecting both the surface and subsurface integrity of the material.
The research indicates that enhancing the surface quality can be realized by reducing the grinding forces, which can be accomplished by increasing the linear velocity of the grinding wheel. Furthermore, the study establishes that the grinding force exhibits a direct proportionality to both the feed rate and the depth of grinding. These findings offer critical insights for optimizing grinding conditions, thereby facilitating the achievement of superior surface finishes.
The validity of the proposed model was rigorously tested, showing a high level of accuracy, with average deviations of 6.616% for normal force and 5.752% for tangential force, thereby confirming the model’s reliability in predicting grinding forces under varying conditions. This research contributes towards a better understanding of surface grinding dynamics and offers a validated theoretical framework for predicting and optimizing grinding forces, thereby improving the surface integrity and quality of Yttria-stabilized Zirconia ceramics.
Future research could examine the suitability of the suggested mathematical model for different materials and grinding parameters, analyze the impact of supplementary variables on grinding forces, and further verify the model’s precision considering machining temperatures and lubricants.