Cong, Y.; Jiang, W.; Dong, Z.; Zhu, J.; Yang, Y.; Wang, Y.; Deng, Q.; Yan, Y.; Mao, J.; Shi, X.;
et al. ACM-Assessor: An Artificial Intelligence System for Assessing Angle Closure Mechanisms in Ultrasound Biomicroscopy. Bioengineering 2025, 12, 415.
https://doi.org/10.3390/bioengineering12040415
AMA Style
Cong Y, Jiang W, Dong Z, Zhu J, Yang Y, Wang Y, Deng Q, Yan Y, Mao J, Shi X,
et al. ACM-Assessor: An Artificial Intelligence System for Assessing Angle Closure Mechanisms in Ultrasound Biomicroscopy. Bioengineering. 2025; 12(4):415.
https://doi.org/10.3390/bioengineering12040415
Chicago/Turabian Style
Cong, Yuyu, Weiyan Jiang, Zehua Dong, Jian Zhu, Yuanhao Yang, Yujin Wang, Qian Deng, Yulin Yan, Jiewen Mao, Xiaoshuo Shi,
and et al. 2025. "ACM-Assessor: An Artificial Intelligence System for Assessing Angle Closure Mechanisms in Ultrasound Biomicroscopy" Bioengineering 12, no. 4: 415.
https://doi.org/10.3390/bioengineering12040415
APA Style
Cong, Y., Jiang, W., Dong, Z., Zhu, J., Yang, Y., Wang, Y., Deng, Q., Yan, Y., Mao, J., Shi, X., Pan, J., Yang, Z., Wang, Y., Fang, J., Zheng, B., & Yang, Y.
(2025). ACM-Assessor: An Artificial Intelligence System for Assessing Angle Closure Mechanisms in Ultrasound Biomicroscopy. Bioengineering, 12(4), 415.
https://doi.org/10.3390/bioengineering12040415