On-Chip Temperature Compensation for Thermal Impedance Sensors †
Abstract
:1. Introduction
2. Experimental
3. Results
Author Contributions
Acknowledgments
Conflicts of Interest
References
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Jaegle, M.; Pernau, H.-F.; Pfützner, M.; Benkendorf, M.; Li, X.; Bartel, M.; Drost, S.; Wöllenstein, J. On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings 2018, 2, 1053. https://doi.org/10.3390/proceedings2131053
Jaegle M, Pernau H-F, Pfützner M, Benkendorf M, Li X, Bartel M, Drost S, Wöllenstein J. On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings. 2018; 2(13):1053. https://doi.org/10.3390/proceedings2131053
Chicago/Turabian StyleJaegle, Martin, Hans-Fridtjof Pernau, Marcus Pfützner, Mike Benkendorf, Xinke Li, Markus Bartel, Susanne Drost, and Jürgen Wöllenstein. 2018. "On-Chip Temperature Compensation for Thermal Impedance Sensors" Proceedings 2, no. 13: 1053. https://doi.org/10.3390/proceedings2131053
APA StyleJaegle, M., Pernau, H. -F., Pfützner, M., Benkendorf, M., Li, X., Bartel, M., Drost, S., & Wöllenstein, J. (2018). On-Chip Temperature Compensation for Thermal Impedance Sensors. Proceedings, 2(13), 1053. https://doi.org/10.3390/proceedings2131053