Glatzl, T.; Beigelbeck, R.; Cerimovic, S.; Steiner, H.; Treytl, A.
Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids. Proceedings 2018, 2, 833.
https://doi.org/10.3390/proceedings2130833
AMA Style
Glatzl T, Beigelbeck R, Cerimovic S, Steiner H, Treytl A.
Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids. Proceedings. 2018; 2(13):833.
https://doi.org/10.3390/proceedings2130833
Chicago/Turabian Style
Glatzl, Thomas, Roman Beigelbeck, Samir Cerimovic, Harald Steiner, and Albert Treytl.
2018. "Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids" Proceedings 2, no. 13: 833.
https://doi.org/10.3390/proceedings2130833
APA Style
Glatzl, T., Beigelbeck, R., Cerimovic, S., Steiner, H., & Treytl, A.
(2018). Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids. Proceedings, 2(13), 833.
https://doi.org/10.3390/proceedings2130833