Kondo, H.; Kurioka, T.; Chiu, W.-T.; Chen, C.-Y.; Wu, J.-Y.; Chang, T.-F.M.; Yamaguchi, M.; Kurosu, H.; Sone, M.
Supercritical CO2-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application. Electrochem 2024, 5, 213-222.
https://doi.org/10.3390/electrochem5020013
AMA Style
Kondo H, Kurioka T, Chiu W-T, Chen C-Y, Wu J-Y, Chang T-FM, Yamaguchi M, Kurosu H, Sone M.
Supercritical CO2-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application. Electrochem. 2024; 5(2):213-222.
https://doi.org/10.3390/electrochem5020013
Chicago/Turabian Style
Kondo, Hikaru, Tomoyuki Kurioka, Wan-Ting Chiu, Chun-Yi Chen, Jhen-Yang Wu, Tso-Fu Mark Chang, Machiko Yamaguchi, Hiromichi Kurosu, and Masato Sone.
2024. "Supercritical CO2-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application" Electrochem 5, no. 2: 213-222.
https://doi.org/10.3390/electrochem5020013
APA Style
Kondo, H., Kurioka, T., Chiu, W. -T., Chen, C. -Y., Wu, J. -Y., Chang, T. -F. M., Yamaguchi, M., Kurosu, H., & Sone, M.
(2024). Supercritical CO2-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application. Electrochem, 5(2), 213-222.
https://doi.org/10.3390/electrochem5020013
