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Journal: Chips, 2024
Volume: 3
Number: 16

Article: PreSCAN: A Comprehensive Review of Pre-Silicon Physical Side-Channel Vulnerability Assessment Methodologies
Authors: by Md Kawser Bepary, Tao Zhang, Farimah Farahmandi and Mark Tehranipoor
Link: https://www.mdpi.com/2674-0729/3/4/16

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