Second IT Revolution and Dynamic Open Innovation: From Smart City, Autonomous Car, Intelligent Robot, and Block Chain to Sharing Economy
A special issue of Journal of Open Innovation: Technology, Market, and Complexity (ISSN 2199-8531).
Deadline for manuscript submissions: closed (31 December 2019) | Viewed by 219399
Special Issue Editors
Interests: open innovation; business model; open innovation economy; social open innovation; Schumpeterian dynamics; complexity; game theory; political economics
Special Issue Information
Dear Colleagues,
This Special Issue will publish some selected papers from the annual conference of SOItmC 2019. Suitable topics include but are not limited to:
- Dynamic open innovation;
- Business models;
- Schumpeterian economics;
- Smart cities;
- Autonomous cars;
- Intelligent robots;
- Block chains;
- Sharing economy;
- 2nd IT Revolution or 4th Industrial Revolution;
- Complexity.
Time schedule of this special issue:
- Open: 1 June 2019
Any SOItmC 2019 authors in addition to the planned papers can submit to this special issue after full paper submission to SOItmC 2019 platfrom and paying the registration fee until 31 May 2019.
- Close: 31 December 2019
All papers should be submitted to this special issue until 31 December 2019.
The Article Processing Charges (APC) of the 10 keynote speech papers will be supported by SOItmC. The authors of these papers should include an acknowledgement section following the example below:
Acknowledgement: This paper was presented as a keynote speech of SOItmC 2019, and the publishing fee was supported by SOItmC.
Papers which were selected for the Special Issue of SOItmC 2019 in JOItmC will be recommended for the Best Paper Award of SOItmC 2019.
Prof. Dr. JinHyo Joseph Yun
Prof. Yuri Sadoi
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Journal of Open Innovation: Technology, Market, and Complexity is an international peer-reviewed open access quarterly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 800 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.