New Advances in Thermal Transport
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics General".
Deadline for manuscript submissions: closed (20 March 2020) | Viewed by 159
Special Issue Editor
Interests: thermal transport
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Over the past years, the study of thermal conductivity has become a key point in order to make advances in the fabrication of new electronic devices. Proper knowledge of the thermal transport of materials, especially in semiconductors, metals, and their contacts, would allow to avoid overheating and a faster release of the heat, for instance. At the same time, this will allow an increase in the operation velocity and reduction in the size of the microprocessors.
Nowadays, the thermal conductivities of a large number of bulk materials have been accurately calculated using ab initio techniques. The Fourier law has been used commonly to understand heat transport at the macroscale, but improvement in experimental techniques and an increase in calculation power have shown that, at the nanoscale (< 10–7 m) or at very fast operation rates (~10–12 s), this law is no longer valid. It has been proven in these ranges that new transport regimes, like hydrodynamic heat flow or ballistic transport, dominate over classical diffusive heat transport.
Despite the level of accuracy achieved, there are still some open questions. For instance, the transition from diffusive to ballistic or hydrodynamic transport regimes is still not clear. Interpretations of spectral information, in terms of characteristic lengths and times, can shed some light on this point in combination with time domain and frequency domain thermoreflectance (TDTR/FDTR) experiments. In addition, the transport effect in metal–semiconductor contacts is another key point under study to improve the design of more powerful electronic devices.
This Special Issue in the journal Applied Sciences, aims to cover recent advances in the development of theoretical models and experimental techniques regarding thermal transport beyond the Fourier law.
Dr. Pol Torres
Guest Editor
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Keywords
- Thermal transport
- thermal conductivity
- phonon hydrodynamics
- ballistic transport
- thermal boundary resistance
- time/frequency domain thermoreflectance
- first principles
- 2D materials
- semiconductors
