Bioinspired Engineering and the Design of Biomimetic Structures: 2nd Edition

A special issue of Biomimetics (ISSN 2313-7673). This special issue belongs to the section "Biomimetics of Materials and Structures".

Deadline for manuscript submissions: 25 October 2024 | Viewed by 105

Special Issue Editor


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Guest Editor
Department of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
Interests: mechanical structure; bioinspired structure design; green materials; 3D/4D printing; fracture mechanics; finite element method; extended finite element method; phase field method
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Special Issue Information

Dear Colleagues,

The hierarchical structure is a widely used strategy to enhance the mechanical properties of biomaterials, as seen in materials such as bamboo, wood, nacre, fish scales, and others. By mimicking the hierarchical structure found in natural materials, researchers can create materials with improved mechanical properties for use in various fields, such as aerospace, construction, and biomedical engineering. The aim of this Special Issue is to gather submissions from different laboratories working on the mechanical behavior of bioinspired hierarchical structures and engineering applications. By making use of the open access format, the current compilation of papers is expected to provide a platform for biomimetic approaches by discovering new and significant research opportunities as well as innovative solutions in bioinspired structures and technology.

To further its aim of combining basic research and applications, this Special Issue is divided into two main parts as follows:

  • Part (a) Bioinspired hierarchical structures, covering topics such as bioinspired hierarchical structure design, biological systems, biomimicry design methods, lattice structure, architected materials, mechanical metamaterials, material mechanics, fracture mechanics, numerical method, 3D/4D printing, freecasting, and material synthesis. 
  • Part (b) Engineering applications, including energy-absorbing structures, medical devices, wings of aircraft, building structures, flexible sensors, and robotics.

We believe that this initiative will fill an important gap in biomimetic structural mechanics and engineering applications.

Dr. Peng Liu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Biomimetics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • hierarchical structure
  • bioinspired structure
  • architected materials
  • mechanical metamaterials
  • solid mechanics
  • numerical method
  • flexible sensor
  • energy absorb
  • 3D/4D printing
  • soft robot

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Published Papers

This special issue is now open for submission.
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