Research on Electronic Packaging Materials
A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Functional Polymer Coatings and Films".
Deadline for manuscript submissions: 31 March 2025 | Viewed by 1989
Special Issue Editor
Special Issue Information
Dear Colleagues,
In the post-Moore's Law era, advanced packaging and materials technologies are becoming increasingly important. Advanced packaging greatly shortens the connection between different chips and further increases the chip efficiency. It has produced many different applications, such as 5G and AI. On the other hand, the development of novel semiconductor materials also provides another new path for future semiconductor devices. Recently, many materials, such as ferroelectric material (FE), oxide semiconductors, 2D material, and 1D carbon nanotubes, have been widely discussed. Therefore, this Special Issue will focus on advanced packaging technology and novel semiconductor material technology. The topics of interest for this Special Issue, in particular, include (but are not restricted to):
- Package Technology;
- 2.5 DIC;
- 3 DIC;
- TSV/RDL/Interposer/Passive Device Integration;
- EDA;
- Novel Semiconductor Materials;
- Ferroelectric material;
- Oxide Semiconductor;
- 2D Materials;
- 1D Materials: Carbon Nanotubes.
Prof. Dr. Ming-Han Liao
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- package
- novel semiconductor materials
- ferroelectric material
- oxide semiconductor
- 2D/1D materials
- thin films
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