Modeling of Phase Separation and Encapsulation Processes in Growing Films
A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Thin Films".
Deadline for manuscript submissions: closed (31 December 2023) | Viewed by 2062
Special Issue Editor
2. Department of Physics, Mathematics and Biophysics, Lithuanian University of Health Sciences, 4 Eivenių St., 50166 Kaunas, Lithuania
Interests: sufaces and interfaces; thin films; computer simulation; kinetic modeling; heterogeneous catalysis; diffusion in solids; plasma processing; interaction of particles with matter
Special Issue Information
Dear Colleagues,
The aim of this Special Issue is the theory, modeling and computer simulations phase separation and encapsulation processes in growing compound thin films taking place during deposition by various methods such as physical and chemical vapor deposition, magnetron sputtering, ion beam assisted deposition, electron beam evaporation and many other methods. Other treatments of compound materials leading to phase separations and encapsulations processes also are in the field of interest. The compound thin film morphology, phase crystalline structure and other structural properties are determined by applied deposition method and it is very important to understand the mechanisms and dynamics of elementary processes taking place during film deposition (adsorption and desorption at non-equilibrium thermodynamic conditions, surface and bulk diffusion, surface chemical reactions at external activation by particle beams (ions, electrons, photons of all electromagnetic spectra), coalescence (considering different mechanisms, activation by external particle beams), clustering, layering, encapsulation, etc.). The deep understanding of elementary processes, their dynamics and mechanisms at different deposition methods allows controlling various physical, chemical and structural properties of films. Despite the huge progress made in theory, mathematical modeling and computer simulation of thin film growth there are still many unanswered questions, especially concerning deposition and growth of multicomponent and compound thin films and coatings, particularly related with phase separation and encapsulation mechanisms. We warmly invite researchers to submit their contributions, both original research articles and review papers, to this Special Issue related with theory, mathematical modeling and computer simulations analyzing kinetics and mechanisms of elementary processes taking place during deposition of compound and multicomponent thin films.
Prof. Dr. Arvaidas Galdikas
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thin film depostion
- phase separation
- encapsulation
- modeling and simulation
