Plasma Dry Etching: Advanced Processes, Plasma Induced Damage and Plasma Diagnostics
A special issue of Coatings (ISSN 2079-6412).
Deadline for manuscript submissions: closed (30 November 2022) | Viewed by 6757
Special Issue Editor
Interests: plasma etching (high-aspect ratio contact etching, atomic-layer etching and low-temperature etching); plasma diagnositics and simulation; magnetic materials (permanet hard magnetic thin films, recording media and exchange bias); X-ray based techniques (synchotron radiation, X-ray diffraction, X-ray reflectivity, X-ray absorption and X-ray photoemission spectroscopy); thin-film stress; surface finishing for anticorrosion
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Special Issue Information
Dear Colleagues,
Dry plasma etching is one of the key processes in advanced manufacturing and faces severe challenges that include atomic scale control, high aspect ratio structure, plasma-induced damage, and limitation of real-time monitoring. Spurred primarily by growing current applications, including advanced logic devices, flash memory and magnetoresistive random access memory, nano-electromechanical systems, energy devices, new processes, instruments, diagnostic techniques, and etching mechanisms to acquire a better understanding are required. Accordingly, we are launching this new Special Issue of Coatings, which will focus on the fundamentals and applications of dry plasma etching in addressing these covered subjects.
This Special Issue will collect original research articles and review papers in the following concepts:
- Theoretical, modeling, and experimental research, knowledge, and new ideas in mechanisms of dry plasma etching;
- Recent developments in etching processes for different materials, including Si-based materials, dielectric materials, polymers, metallic films, and carbon-based materials;
- Advanced atomic layer etching and high aspect ratio contact etching with high speed;
- Etching characteristics at different environments: high temperature and cryogenic etching;
- The latest development of etching instruments considering but not limit to high-density plasma process reactors, surface temperature control and monitoring, and power and time modulations;
- Monitoring and understanding mechanisms of plasma-induced damage and new reduction processes;
- Computer modeling, simulation for etching characteristics and chemistrics;
- Plasma diagnostics for etching processes.
Dr. Shih-Nan Hsiao
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- advanced process for plasma etching
- atomic layer etching and high aspect ratio contact etching
- plasma-induced damage
- plasma diagnostics
- etching modeling
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