New Semiconductor Materials, Devices, Power Applications, and Radiation Effects

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials".

Deadline for manuscript submissions: closed (15 March 2024) | Viewed by 2068

Special Issue Editors


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Guest Editor
Key Laboratory of Wide Band-Gap Semiconductors and Devices, School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: GaN-based power devices; device reliability; power applications
Key Laboratory of Wide Band-Gap Semiconductors and Devices, School of Microelectronics, Xidian University, Xi’an 710071, China
Interests: SiC power devices; device reliability; mechanism of device radiation effects
Beijing Microelectronics Technology Institute, Beijing 100076, China
Interests: power devices; power conversion circuits; radiation effects

Special Issue Information

Dear Colleagues,

In recent years, in the topic of power devices and integrated circuits, researchers have carried out a large number of scientific and engineering applications in new materials, new structural devices and power applications, making important breakthroughs. New materials include wide bandgap semiconductors (GaN, SiC), ultra-wide band gap semiconductors (Ga2O3, diamond, AlGaN, AlN), carbon-based materials and other semiconductor materials. New structural devices include lateral HEMT, grooved VDMOSFET, trench MOSFET, vertical Fin MOSFET, super junction, etc. New semiconductor materials have superior characteristics, such as high breakdown electric field, low specificity of resistance and high temperature resistance. Combined with innovations in device structure, they can make power circuits, such as DC–DC and AC–DC, more efficient, smaller and more powerful. In addition, new materials, devices and circuits have also received extensive attention in total dose, single event effect and other radiation aspects.

This topic focuses on the direction of new materials and new structural devices, providing new ideas for the development of power integrated circuits and radiation applications. The submission of high-quality original research and review articles in this field is welcomed. The topics of interest include, but are not limited to:

  • Wide bandgap semiconductor (SiC, GaN);
  • Ultra-wide bandgap semiconductor (Ga2O3, diamond, AlGaN, AlN, BN);
  • Compound semiconductor materials and devices;
  • Power conversion circuits;
  • Packaging of wide bandgap semiconductor devices;
  • Devices and circuits reliability;
  • Total dose and single event effects.

Dr. Shenglei Zhao
Dr. Hao Yuan
Dr. Lei Shu
Guest Editors

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Keywords

  • wide bandgap devices
  • power conversion circuits
  • single event effects
  • gallium nitride
  • silicon carbide

Published Papers (1 paper)

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Review

15 pages, 11909 KiB  
Review
Research Progress in Breakdown Enhancement for GaN-Based High-Electron-Mobility Transistors
by Zhiwen Tian, Xuan Ji, Dongwei Yang and Pei Liu
Electronics 2023, 12(21), 4435; https://doi.org/10.3390/electronics12214435 - 27 Oct 2023
Cited by 1 | Viewed by 1561
Abstract
The breakdown characteristics are very important for GaN high-electron-mobility transistors (HEMTs), which affect the application voltage, power density, efficiency, etc. In order to further enhance the breakdown voltage of the device, it is necessary to carry out research on the breakdown mechanisms of [...] Read more.
The breakdown characteristics are very important for GaN high-electron-mobility transistors (HEMTs), which affect the application voltage, power density, efficiency, etc. In order to further enhance the breakdown voltage of the device, it is necessary to carry out research on the breakdown mechanisms of the device. This article summarizes several breakdown mechanisms of GaN devices, including electric field concentration, buffer leakage current, gate leakage current, and vertical breakdown. In order to suppress the breakdown mechanisms, techniques such as the use of a field plate, reduced surface field (RESURF), back barrier, gate dielectric, substrate removal, and addition of AlGaN channels can be developed. With the continuous development of various technologies, the breakdown characteristics of GaN devices can be fully explored, laying the foundation for improving the performance of power electronic systems. Full article
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