Soft Electronics and Their Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Flexible Electronics".
Deadline for manuscript submissions: 15 January 2025 | Viewed by 70
Special Issue Editor
Interests: bioengineering; soft electronics; wearable healthcare; human machine interfaces; bioelectronics; printed electronics; screen printing; aerosol jet printing; signal processing; ECG; machine learning; soft robotics
Special Issue Information
Dear Colleagues,
Significant recent interest has been focused on the emerging area of soft electronics, where electronic devices and sensors are made to seamlessly integrate with humans and other non-planar surfaces. Where traditional electronics are composed of brittle materials, soft electronics incorporate deformable conductors into a variety of flexible and stretchable substrates with mechanical properties that can be tuned to specific applications. These devices have a wide array of applications in wearable healthcare, implanted bioelectronics, human-interfaced sensors, soft robotics, garment-integrated electronics, and other fields involving placing electronics on non-rigid platforms. Currently, there are significant opportunities to further improve the mechanical properties of these devices, approaches to their production, their advanced functionality and material composition, particularly with respect to improving healthcare outcomes. Therefore, this Special Issue seeks to communicate groundbreaking research in soft electronics and their applications, and the following areas are particularly, but not exclusively, encouraged:
(1) materials engineering strategies that improve the electronic properties of stretchable polymers, including bandgap structure, electrical conductance, dielectric responses, and electromagnetic properties;
(2) wearable/implantable biomedical devices and sensors for health monitoring and therapy;
(3) transient devices that can be dissolved in a biological environment;
(4) advanced fabrication strategies, including high-throughput and additive manufacturing approaches.
We look forward to receiving your submissions!
Dr. Nathan Zavanelli
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- soft electronics
- wearable devices
- implantable devices
- conductive polymers
- transient devices
- soft robotics
- micro-/nanofabrication
- printed electronics
- bioelectronics
