LTCC for Space, Imaging, Telecommunication, and Medical Applications
A special issue of Electronics (ISSN 2079-9292).
Deadline for manuscript submissions: closed (31 October 2020) | Viewed by 5046
Special Issue Editor
Interests: LTCC design and manufacturing; microwave and mm-wave MMIC design and packaging
Special Issue Information
Dear Colleagues,
Since the late seventies, low-temperature co-fired ceramics (LTCCs) have proven their functionality in different areas such as electronics, microfluidics, and sensor devices. Even though this type of material is now well known, scientists and research engineers keep elaborating new compositions for specific usages such as high dielectric material for further miniaturization of microwave devices, lower loss material for better high frequency results tending towards the THz range, printable material for 3D integration, ferromagnetic material for circulators and isolators, and others. Manufacturing methods and parameters have been revisited, and techniques such as 3D and ink jet printing, embossing, and laser cutting are elaborated to enhance the scope of LTCC usage.
This Special Issue concerns the latest developments and accomplishments in LTCC on the subjects of preparation of the LTCC material itself, and manufacturing procedures and design strategies for devices intended for, but not limited to, space, imaging, telecommunication, and medical applications.
Topics of interest include but not limited to:
- LTCC (low-temperature co-fired ceramic);
- material composition and properties;
- manufacturing (or fabrication) methods;
- design strategies; devices—sensors, microsystems, microfluidic, medical, imaging; RF to THz
Dr. Camilla Kärnfelt
Guest Editor
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