Advances in Surface Modification for Adhesive Bonding
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Materials Characterization".
Deadline for manuscript submissions: closed (20 March 2024) | Viewed by 883
Special Issue Editors
Interests: adhesive bonding; surface preparation; finite element modeling; composite materials
Interests: adhesive bonding; surface preparation; mechanical behavior of materials; finite element modeling; hygienic design; integrated and virtual methods for product development
Special Issue Information
Dear Colleagues,
Adhesive bonding is a joining technology whose application is continuously increasing in several industrial fields. This is due to the several benefits it can bring, for example, assembly lightweight, even stress distribution, improved aesthetics and, often, the capability to connect different materials together.
However, adhesive bonding works via surface action and an effective interaction between the adhesive and the substrate is required to ensure adequate bond strength. The complexity of this issue is increased by considering the different chemical nature of substrates and the technological aspects that a wide range of materials to be connected can bring.
In this context, several methods have been developed in recent years to improve the strength of the interface between the adhesive and the substrate, and new ideas and solutions are continuously being generated.
The aim of this Special Issue is therefore to collect the latest scientific studies exploring methods and technologies to improve the strength at the interface. Experimental studies describing innovations in the application of chemical or physical treatments developed to toughen the interfaces of adhesive bonded joints are encouraged, as well as papers illustrating new strategies to modify the surface morphology (from the nano to the meso scale) and chemistry in order to increase the joints’ strength and durability under typical working conditions. Additionally, review papers on these topics are welcome.
Dr. Fabrizio Moroni
Dr. Francesco Musiari
Guest Editors
Manuscript Submission Information
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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- adhesive bonding
- durability
- surface treatments
- toughening
- laser ablation
- plasma
- abrasion
- etching
- anodizing
- coating
