Physical and Mechanical Properties of Advanced Micro-/Nano-Composite Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".
Deadline for manuscript submissions: 10 January 2025 | Viewed by 39
Special Issue Editors
Interests: polymer composites; electronics packaging; optoelectronics; electrical and thermal transport; adhesion and interfaces; photophysics
Interests: polymer composites; thermal conductivity; heat build-up property; electromagnetic absorption property; surface modification
Interests: polymer composites; thermal conductivity; heat build-up property; electromagnetic absorption property; surface modification
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
We would like to invite you to revisit and share your recent advances in functional and structural composite materials. When two distinct materials mix, novel behaviors beyond the rules of the mixture often emerge, especially when phase separation reaches the nano-scale. Interfaces play a crucial role in these systems; from electrical, thermal, and mechanical points of view, these regions are to be targeted and utilized for our benefit. This Special Issue welcomes contributions on the processing–structure–property relationships in composite materials for electronic, structural, and energy applications, highlighting the design power of matrix/filler chemistry, dimensionality, and surface treatments, as well as the capability of novel characterization methods and modelling efforts. Topics of interest include and are not limited to the following:
- Micro-/nano-material synthesis and processing techniques for improved compounding and structure–property relationships;
- Physical/mechanical characterization and modeling methods for functional and structural composite materials;
- Filler–matrix interactions and effects on mechanical, thermomechanical, dielectric, electrochemical, and optical properties;
- Interface electrical/thermal transport, absorption, friction, and energy generation/dissipation;
- Demonstration and performance prediction in electronics and industrial applications.
Original contributions in the forms of reviews, full papers, and communications are all welcome.
Dr. Jiaxiong Li
Dr. Dong An
Prof. Dr. Rong Zhang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- nanocomposites
- mechanical properties
- visco-elasticity
- thermo-mechanical properties
- electrical and dielectric properties
- thermal transport electromagnetic absorption
- heat build-up interfaces and adhesion
