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Electrodeposition and Properties of Crystals

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: closed (31 March 2020) | Viewed by 2818

Special Issue Editor


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Guest Editor
Institute of Chemistry, University of Bialystok, Bialystok, Poland
Interests: fullerenes; carbon nanostructures; conducting polymers; electrodeposition; low-dimensional conducting metalloorganic crystals

Special Issue Information

Dear Colleagues,

The development of novel materials with designed morphology, molecular structure, and controllable size has been a rapidly growing field of research. Electrochemical methods are commonly used in these studies, both in new material synthesis and in their characterization. Electrodeposition is widely applied for the preparation of materials such as metals, metal oxides, metal alloys, semiconductors, polymers, and many others. Electrocrystallization is a particular case of electrodeposition. It is a relatively low-cost method which enables the formation of materials having well-defined crystal structures. The composition and amount of electrodeposited material can be easily controlled by current density or potential. Electrocrystallization processes also allow the deposition of synthesized material directly at the electrode surface. The physical and chemical properties can be controlled by tuning the crystallite size. Recently, electrocrystallization is also frequently used in the formation of nanomaterials and in the nanostructuring of electrode surfaces. Phase formation and crystal growth phenomena are also involved in a number of technologically important processes. This Special Issue is focused on the different aspects of electrocrystallization, both in basic electrochemistry and technology.

The topics of interest include, but are not limited to:

-    Theoretical fundamentals of electrocrystallization processes;

-    Computational modeling of electrocrystallization processes;

-    Electrocrystallization of metals;

-    Intermetallic phases formation;

-    Underpotential deposition processes;

-    Electrocrystallization of metal oxides;

-    Electrochemical deposition of low-dimensional systems;

-    Electrocrystallization of organic materials;

-    Electrodeposition of polymeric materials;

-    Electrochemical fabrication of nanostructured materials;

-    Electrochemical structuring of metallic surfaces;

-    Influence of electrode surface on the electrocrystallization processes;

-    Implications of experimental conditions (temperature, solvent, stirring conditions, etc.) on the electrocrystallization processes;

-    X-ray crystallography of electrodeposited materials;

-    Microscopic techniques (STM, AFM, SEM, TEM, etc.) in the study of electrocrystallization;

-    Electrocrystallization-based technological processes;

-    Environmentally-friendly electrocrystallization processes.

Prof. Dr. Krzysztof Winkler
Guest Editor

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • electrocrystallization
  • electrodeposition
  • low-dimensional crystals
  • electrochemical properties of crystalline materials
  • nanostructured materials

Published Papers (1 paper)

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Research

12 pages, 7824 KiB  
Article
Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films
by Tatsuya Tsurusaki and Takeshi Ohgai
Materials 2020, 13(6), 1330; https://doi.org/10.3390/ma13061330 - 14 Mar 2020
Cited by 4 | Viewed by 2522
Abstract
Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to [...] Read more.
Enforced solid solution type Sn-Zn alloy films were electrochemically synthesized on Cu substrate from an aqueous solution containing citric acid complexes. The electrodeposition behavior of Sn-Zn alloys was classified to a normal co-deposition type, in which electrochemically nobler Sn deposits preferentially compared to Zn. Electrodeposited Sn-Zn alloy films were composed of a non-equilibrium phase, like an enforced solid solution, which was not observed in an equilibrium phase diagram of an Sn-Zn binary alloy system. By applying a thermal annealing process at 150 °C for 10 minutes, a pure Zn phase was precipitated from an electrodeposited Sn-based solid solution phase with excessively dissolved Zn atoms. During the soldering process, intermetallic phases such as Cu3Sn and Cu5Zn8 were formed at the interface between an Sn-Zn alloy and Cu substrate. Tensile strength and fracture elongation of solder-jointed Cu rods with Sn-8 at.%Zn alloy films reached ca. 40 MPa and 12%, respectively. Full article
(This article belongs to the Special Issue Electrodeposition and Properties of Crystals)
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