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Microstructure and Performance Evolution Behavior of Materials under Non-equilibrium Solidification Conditions

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: closed (20 May 2022) | Viewed by 1298

Special Issue Editors


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Guest Editor
Material Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
Interests: metals and alloys; advanced composites; melting and solidification; additive manufacturing

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Guest Editor Assistant
College of Mechanical Engineering, Shandong University of Technology, Zibo, China
Interests: high entropy alloys; additive manufacturing; high performance and quality coating

Special Issue Information

Dear Colleagues,

Nowadays, high-entropy alloys have been in focus in scientific research as a kind of novel material. As an ancient and advanced technology, solidification plays a very important role in the preparation and forming of these advanced materials. For example, titanium alloys can be smelted to prepare alloy ingots, high-quality titanium alloy powder can be prepared by atomization, and alloy components can be prepared by additive manufacturing methods.

This Special Issue focuses on metallic materials and their composites, studying the influence of the solidification behaviors on the alloy compositions and solidification structures, under different solidification conditions, solidification speeds and melt scales. We aim to study the evolution laws of solidification structures, explore the effect of the solidification process on material properties, and reveal the importance of solidification in the process of material preparation and forming. We kindly invite researchers to contribute to this Special Issue.

Prof. Dr. Liang Wang
Dr. Nana Guo
Guest Editors

Manuscript Submission Information

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Keywords

  • solidification behavior
  • structure evolution
  • phase and substructure
  • mechanical properties

Published Papers (1 paper)

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Research

11 pages, 4201 KiB  
Article
Microstructure Evolution and Toughening Mechanism of a Nb-18Si-5HfC Eutectic Alloy Created by Selective Laser Melting
by Longhui Yao, Liang Wang, Xiaojiao Song, Ran Cui, Binqiang Li, Qi Lv, Liangshun Luo, Yanqing Su, Jingjie Guo and Hengzhi Fu
Materials 2022, 15(3), 1190; https://doi.org/10.3390/ma15031190 - 4 Feb 2022
Viewed by 1418
Abstract
Because of their superior mechanical performance at ultra-high temperatures, refractory niobium–silicon-based alloys are attractive high-temperature structural alloys, particularly as structural components in gas turbine engines. However, the development of niobium–silicon-based alloys for applications is limited because of the trade-off between room temperature fracture [...] Read more.
Because of their superior mechanical performance at ultra-high temperatures, refractory niobium–silicon-based alloys are attractive high-temperature structural alloys, particularly as structural components in gas turbine engines. However, the development of niobium–silicon-based alloys for applications is limited because of the trade-off between room temperature fracture toughness and high-temperature strength. Here, we report on the fabrication of a Nb-18Si alloy with dispersion of hafnium carbide (HfC) particles through selective laser melting (SLM). XRD and SEM-BSE were used to examine the effects of scanning speed on the microstructure and the phase structure of the deposited Nb-18Si-5HfC alloy. The results show that when the scanning speed rises, the solid solubility of the solid solution improves, the interlamellar spacing of eutectics slowly decrease into nano-scale magnitude, and the corresponding hafnium carbide distribution becomes more uniform. We also discover the hafnium carbide particles dispersion in the inter-lamella structure, which contributes to its high fracture toughness property of 20.7 MPa∙m1/2 at room temperature. Hardness and fracture toughness are simultaneously improved because of the control of microstructure morphology and carbide distribution. Full article
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