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Advances in Design, Performance and Applications of Electrochemical Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Chemistry".

Deadline for manuscript submissions: 20 December 2024 | Viewed by 2471

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Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei 106, Taiwan
Interests: environmental contaminants monitoring; electrochemical sensor; photocatalysis; deep eutectic solvents; advanced functional nanomaterial synthesis
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Special Issue Information

Dear Colleagues,

This Special Issue of Materials, entitled "Advances in Design, Performance, and Applications of Electrochemical Materials", delves into the latest innovations and breakthroughs in the field of electrochemical materials. Electrochemical materials are integral to a wide range of applications, including energy storage, electrocatalysis, sensors, and more. This collection of research articles intends to showcase cutting-edge developments in the design, synthesis, and characterization of materials that have a profound impact on enhancing performance and enabling novel applications in electrochemistry. This Special Issue brings together contributions from experts in materials science, chemistry, and engineering, presenting a comprehensive view of the current state of the art and future prospects in this dynamic field. From new materials for energy storage to advanced electrocatalysts for green chemistry, this Issue offers valuable insights into the evolving landscape of electrochemical materials.

Dr. Balasubramanian Sriram
Guest Editor

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Keywords

  • electrochemical materials
  • materials design
  • performance enhancement
  • energy storage
  • electrocatalysis
  • sensor applications
  • materials synthesis
  • characterization techniques
  • green chemistry
  • research advancements

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Published Papers (3 papers)

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Research

16 pages, 7810 KiB  
Article
Study of Effects of Post-Weld Heat Treatment Time on Corrosion Behavior and Manufacturing Processes of Super Duplex Stainless SAF 2507 for Advanced Li-Ion Battery Cases
by Yoon-Seok Lee, Jinyong Park, Jung-Woo Ok, Seongjun Kim, Byung-Hyun Shin and Jang-Hee Yoon
Materials 2024, 17(16), 4107; https://doi.org/10.3390/ma17164107 - 19 Aug 2024
Viewed by 598
Abstract
Lithium-ion batteries are superior energy storage devices that are widely utilized in various fields, from electric cars to small portable electric devices. However, their susceptibility to thermal runaway necessitates improvements in battery case materials to improve their safety. This study used electrochemical analyses, [...] Read more.
Lithium-ion batteries are superior energy storage devices that are widely utilized in various fields, from electric cars to small portable electric devices. However, their susceptibility to thermal runaway necessitates improvements in battery case materials to improve their safety. This study used electrochemical analyses, including open-circuit potential (OCP), potentiodynamic polarization, and critical pitting temperature (CPT) analyses, to investigate the corrosion resistance of super duplex stainless steel (SAF 2507) applied to battery cases in relation to post-weld heat treatment (PWHT) time. The microstructure during the manufacture, laser welding, and PWHT was analyzed using field-emission scanning electron microscopy, X-ray diffraction, and electron backscatter diffraction, and the chemical composition was analyzed using dispersive X-ray spectroscopy and electron probe micro-analysis. The PWHT increased the volume fraction of austenite from 5% to 50% over 3 min at 1200 °C; this increased the OCP from −0.21 V to +0.03 V, and increased the CPT from 56 °C to 73 °C. The PWHT effectively improved the corrosion resistance, laying the groundwork for utilizing SAF 2507 in battery case materials. But the alloy segregation and heterogeneous grain morphology after PWHT needs improvement. Full article
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14 pages, 6005 KiB  
Article
Fabrication of Strontium Molybdate with Functionalized Carbon Nanotubes for Electrochemical Determination of Antipyretic Drug-Acetaminophen
by Dhanashri D. Khandagale and Sea-Fue Wang
Materials 2024, 17(12), 2887; https://doi.org/10.3390/ma17122887 - 13 Jun 2024
Viewed by 683
Abstract
In recent years, there has been a significant interest in the advancement of electrochemical sensing platforms to detect antipyretic drugs with high sensitivity and selectivity. The electrochemical determination of acetaminophen (PCT) was studied with strontium molybdate with a functionalized carbon nanotube (SrMoO4 [...] Read more.
In recent years, there has been a significant interest in the advancement of electrochemical sensing platforms to detect antipyretic drugs with high sensitivity and selectivity. The electrochemical determination of acetaminophen (PCT) was studied with strontium molybdate with a functionalized carbon nanotube (SrMoO4@f-CNF) nanocomposite. The SrMoO4@f-CNF nanocomposite was produced by a facial hydrothermal followed by sonochemical treatment, resulting in a significant enhancement in the PCT determination. The sonochemical process was applied to incorporate SrMoO4 nanoparticles over f-CNF, enabling a network-like structure. Moreover, the produced SrMoO4@f-CNF composite structural, morphological, and spectroscopic properties were confirmed with XRD, TEM, and XPS characterizations. The synergistic effect between SrMoO4 and f-CNF contributes to the lowering of the charge transfer resistance (Rct=85 ·cm2), a redox potential of Epc=0.15 V and Epa=0.30 V (vs. Ag/AgCl), and a significant limit of detection (1.2 nM) with a wide response range of 0.01–28.48 µM towards the PCT determination. The proposed SrMoO4@f-CNF sensor was studied with differential pulse voltammetry (DPV) and cyclic voltammetry (CV) techniques and demonstrated remarkable electrochemical properties with a good recovery range in real-sample analysis. Full article
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14 pages, 9822 KiB  
Article
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications
by Jeng-Hau Huang, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung and Chengheng Robert Kao
Materials 2024, 17(7), 1638; https://doi.org/10.3390/ma17071638 - 3 Apr 2024
Viewed by 873
Abstract
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints [...] Read more.
This article presents a novel bonding method for chip packaging applications in the semiconductor industry, with a focus on downsizing high-density and 3D-stacked interconnections to improve efficiency and performance. Microfluidic electroless interconnections have been identified as a potential solution for bonding pillar joints at low temperatures and pressures. However, the complex and time-consuming nature of their production process hinders their suitability for mass production. To overcome these challenges, we propose a tailored plating solution using an enhanced copper concentration and plating rate. By eliminating the need for fluid motion and reducing the process time, this method can be used for mass production. The Taguchi approach is first used to optimize the copper–quadrol complex solution with the plating rate and decomposition time. This solution exhibits a copper concentration that is over five times higher than that of conventional solutions, a plating rate of 22.2 μm/h, and a decomposition time of 8 min on a Cu layer substrate. This technique enables Cu pillars to be successfully bonded within 7 min at 35 °C. Planarizing the pillar surface yields a high bonding percentage of 99%. Mechanical shear testing shows a significant fracture strength of 76 MPa. Full article
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