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Functionally Graded Materials: Structures, Properties, and Applications
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Functionally Graded Materials: Structures, Properties, and Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Composites".

Deadline for manuscript submissions: closed (30 September 2021) | Viewed by 4507

Special Issue Editor

Prof. Dr. Hideaki Tsukamoto

E-Mail Website1 Website2
Guest Editor
Department of Mechanical Engineering, Faculty of Science and Engineering, Hosei University, Tokyo, Japan
Interests: composites; functionally graded materials (FGMs); powder metallurgy; micromechanics; mechanical property
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Functionally graded materials (FGMs) are multi-phase composites to be engineered with gradual spatial variations of constituents, which result in smooth variation of thermal, mechanical, electrical, and other properties. The advantages of FGMs to two dissimilar materials joined directly together include smoothing of stress distributions across the layers, minimization or elimination of stress concentrations and singularities at the interface corners and increase in bonding strength. These advantages are achieved by fabricating FGMs with predetermined gradual spatial variations of the volume fractions and microstructures of the material constituents according to functional performance requirements. FGMs have been successfully accepted in a variety of industries such as aerospace, automobile, energy fields and biomedical fields due to their ability to tailor properties gradually and avoid concentrations in properties between two bonded materials.

This Special Issue aims to collect recent studies on properties and applications of structural FGMs. Manuscripts are invited from various researchers/investigators so they may contribute to this Special Issue with their original research articles, short communications, and review articles.

Prof. Dr. Hideaki Tsukamoto
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • functionally graded materials (FGMs)
  • composites
  • micromechanics
  • materials design
  • structural design
  • mechanical property

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Published Papers (2 papers)

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Research

13 pages, 3248 KiB  
Article
Experimental Investigation of Stress Distributions in 3D Printed Graded Plates with a Circular Hole
by Quanquan Yang, He Cao, Youcheng Tang, Yun Li and Xiaogang Chen
Materials 2021, 14(24), 7845; https://doi.org/10.3390/ma14247845 - 18 Dec 2021
Cited by 2 | Viewed by 1984
Abstract
An experimental investigation is presented for the stress distributions in functionally graded plates containing a circular hole. On the basis of the authors’ previously constructed theoretical model, two kinds of graded plates made of discrete rings with increasing or decreasing Young’s modulus were [...] Read more.
An experimental investigation is presented for the stress distributions in functionally graded plates containing a circular hole. On the basis of the authors’ previously constructed theoretical model, two kinds of graded plates made of discrete rings with increasing or decreasing Young’s modulus were designed and fabricated in virtue of multi-material 3D printing. The printed graded plates had accurate size, smooth surface, and good interface. The strains of two graded plates under uniaxial tension were measured experimentally using strain gages. The stresses were calculated within the range of linear elastic from the measured strains and compared with analytical theory. It is found that the experimental results are consistent with the theoretical results, and both of them indicate that the stress concentration around the hole reduces obviously in graded plates with radially increasing Young’s modulus, in comparison with that of perforated homogenous plates. The successful experiment in the paper provides a good basis and support for the establishment of theoretical models and promotes the in-depth development of the research field of stress concentration in functionally graded plates. Full article
(This article belongs to the Special Issue Functionally Graded Materials: Structures, Properties, and Applications)
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12 pages, 4914 KiB  
Article
Fabrication of Functionally Graded Diamond/Al Composites by Liquid–Solid Separation Technology
by Hongyu Zhou, Yaqiang Li, Huimin Wang, Minrui Ran, Zhi Tong, Weidong Zhang, Junyou Liu and Wenyue Zheng
Materials 2021, 14(12), 3205; https://doi.org/10.3390/ma14123205 - 10 Jun 2021
Cited by 7 | Viewed by 1860
Abstract
The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. [...] Read more.
The electronic packaging shell, the necessary material for hermetic packaging of large microelectronic device chips, is made by mechanical processing of a uniform block. However, the property variety requirements at different positions of the shell due to the performance have not been solved. An independently developed liquid–solid separation technology is applied to fabricate the diamond/Al composites with a graded distribution of diamond particles. The diamond content decreases along a gradient from the bottom of the shell, which houses the chips, to the top of the shell wall, which is welded with the cover plate. The bottom of the shell has a thermal conductivity (TC) of 169 W/mK, coefficient of thermal expansion (CTE) of 11.0 × 10−6/K, bending strength of 88 MPa, and diamond content of 48 vol.%. The top of the shell has a TC of 108 W/mK, CTE of 19.3 × 10−6/K, bending strength of 175 MPa, and diamond content of 15 vol.%, which solves the special requirements of different parts of the shell and helps to improve the thermal stability of packaging components. Moreover, the interfacial characteristics are also investigated. This work provides a promising approach for the preparation of packaging shells by near-net shape forming. Full article
(This article belongs to the Special Issue Functionally Graded Materials: Structures, Properties, and Applications)
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