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Solidification Processing and Welding of Different Materials System

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: closed (20 November 2022) | Viewed by 2130

Special Issue Editor


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Guest Editor
School of Mechanical Engineering, Vellore Institute of Technology, Vellore 632014, India
Interests: metal joining; additive manufacturing; corrosion; energy storage materials; materials characterization; heat treatment; coatings
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Special Issue Information

Dear Colleagues,

Hybrid material systems have gained much interest in various industries in the recent past, including aerospace and automotive. Weldment behavior and vehicle weight have been major concerns in the automotive and aerospace sectors. Incorporating metal-polymer/ceramic/composite hybrid structures reduces weight without compromising structural performance. High energy density and solid-state welding techniques are beneficial for joining various dissimilar materials systems. The major problem associated with the welding of different materials systems is the formation of secondary phases, which leads to premature weldment failures. Unfortunately, there have been very few studies covering these challenges yet. This Special Issue aims to present the major challenges in the field of joining technologies for various grades of materials systems, such as metal-polymer/metal-ceramic/ metal-composite, etc.

Prof. Dr. Arivazhagan Natarajan
Guest Editor

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Keywords

  • solid-state welding
  • high density welding
  • hybrid joints
  • metal-polymer
  • metal-ceramic
  • metal-composite
  • weldment behavior

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Published Papers (1 paper)

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Research

11 pages, 13446 KiB  
Article
Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints
by Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou and Chih Chen
Materials 2022, 15(20), 7115; https://doi.org/10.3390/ma15207115 - 13 Oct 2022
Viewed by 1878
Abstract
In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 × 104 A/cm2) or low (1.6 × 104 A/cm2) current densities. Failures in the solder joints with different grain [...] Read more.
In this study, symmetrical solder joints (Cu/Ni/SnAg2.3/Ni/Cu) were fabricated. They were electromigration (EM)-stressed at high (8 × 104 A/cm2) or low (1.6 × 104 A/cm2) current densities. Failures in the solder joints with different grain orientations under EM stressing were then characterized. Results show that Ni under-bump-metallurgy (UBM) was quickly dissolved into the solder joints possessing low angles between Sn c-axis and electron direction and massive NiCuSn intermetallic compounds formed in the Sn matrix. The diffusion rate of Ni increased with decreasing orientation grain angle. A theoretical model was also established to analyze the consumption rate of Ni UBM. Good agreement between the modeling and experimental results was obtained. Additionally, we found that voids were more likely to form in the solder joints under high EM stressing. Full article
(This article belongs to the Special Issue Solidification Processing and Welding of Different Materials System)
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