Computational Methods and AI Applications in Semiconductor Engineering
A special issue of Mathematical and Computational Applications (ISSN 2297-8747). This special issue belongs to the section "Engineering".
Deadline for manuscript submissions: 15 March 2025 | Viewed by 51
Special Issue Editor
Interests: additive manufacturing; numerical simulation; machine learning; electronic packaging; artificial intelligence; sampling algorithms
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The semiconductor industry is experiencing rapid advancements driven by the integration of computational methods and artificial intelligence (AI). This Special Issue focuses on innovative research and applications that leverage these advanced techniques to address challenges in semiconductor engineering. Topics include state-of-the-art numerical simulations, such as finite element analysis and computational fluid dynamics, tailored for semiconductor device modeling. Additionally, this issue explores cutting-edge AI and machine learning algorithms for predictive modeling, design optimization, and process control in semiconductor manufacturing. Emphasis is placed on the integration of AI with traditional methods to solve complex problems, reliability and failure analysis, and the exploration of emerging technologies like quantum computing and photonics. Practical case studies showcasing real-world applications of these computational techniques and AI in semiconductor design, fabrication, and testing are also featured. This Special Issue aims to bring together researchers and practitioners from academia and industry, fostering collaboration and driving innovation in the semiconductor sector. Contributions presenting original research, comprehensive reviews, and insightful perspectives are highly encouraged.
Dr. Weishen Chu
Guest Editor
Manuscript Submission Information
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Keywords
- predictive modeling
- design optimization
- process control
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