Mathematical Modeling and Artificial Intelligence in Engineering

A special issue of Mathematics (ISSN 2227-7390). This special issue belongs to the section "Engineering Mathematics".

Deadline for manuscript submissions: 30 June 2025

Special Issue Editor


E-Mail Website
Guest Editor
Department of Computer and Information Science, University of Pennsylvania, Philadelphia, PA 19104, USA
Interests: additive manufacturing; numerical simulation; machine learning; electronic packaging; artificial intelligence; sampling algorithms
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to invite submissions to the Special Issue titled " Mathematical Modeling and Artificial Intelligence in Engineering". This Special Issue seeks to advance the discourse on the integration of artificial intelligence and mathematical modeling in engineering, with an emphasis on innovative and applied research that addresses complex technical challenges.

Our aim is to create a platform where industry professionals, especially those with a wealth of practical experience but limited publication history, can share their insights and innovations. This Special Issue is an excellent opportunity for engineers and software developers to enhance their professional profiles and engage with the broader academic and industrial communities.

We encourage submissions that exemplify the state-of-the-art research and applications in AI and mathematical modeling across various engineering disciplines. Manuscripts that elucidate the practical implications of these technologies in solving real-world engineering problems are particularly welcome.

Dr. Weishen Chu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Mathematics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Artificial Intelligence
  • Machine Learning
  • Engineering Applications
  • Mathematical Modeling
  • Industrial Automation
  • Semiconductor Engineering

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop