Advances in High-Entropy Alloys’ Microstructure, Properties and Preparation

Dear Colleagues,

The advent of high- and medium-entropy alloys (HEAs and MEAs) has broken through traditional alloy design methodologies, attracting increasing research attention due to their advanced performance and outstanding properties. Recent progress in compositional and structural design concepts, as well as preparation techniques, have further enhanced the performance of HEAs and MEAs, a topic within the scope of this Special Issue. Owing to excellent strength–ductility tradeoff, fracture toughness at ambient and cryogenic temperatures, high-temperature capability, tribological performance, irradiation behavior, corrosion/oxidation resistance, etc., HEAs and MEAs are considered promising candidates for future applications in a wide range of industries, including in the aerospace, nuclear, marine, biomedical, energy, and mining fields.

In this Special Issue, we welcome review articles and research papers that focus on microstructure, property, and preparation advances in high-entropy alloys and shed light on future research directions. The topics will include but are not limited to the following: (1) various types of HEAs and MEAs, including 3D transitional, refractory, lightweight, single-phase, precipitation-strengthened, eutectic/eutectoid, gradient, and bimodal-grained models; (2) various strengthening and plasticity mechanisms, including twining, phase transformation, dispersed particles, nanostructures, dislocation structures, microbands, and cell structures; (3) various advanced design methods, including high-throughput thermodynamics/kinetics calculation and screening, machine learning, molecular dynamics, and density functional theory; (4) various advanced preparation techniques, including arc-melting, powder metallurgy, additive manufacturing for bulk HEAs and MEAs, and jet/plasma spraying for HEA and MEA coatings; and (5) various advanced characterization tools, including 3D atomic probe tomography and in situ transmission electron microscope.

Dr. Chao Yang
Guest Editor

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