Crystallography on Metallic Metasatable Phases in Materials Design, Processing, Science and Engineering

A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Crystallography and Applications of Metallic Materials".

Deadline for manuscript submissions: 20 January 2025 | Viewed by 964

Special Issue Editors


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Guest Editor
State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
Interests: metallic metasatable phases; multiscale modeling; characterization; crystallography; defects; physical properties; innovation
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
State Key Laboratory of Metastable Materials Science & Technology, Yanshan University, Qinhuangdao 066004, China
Interests: metallic metasatable phases; multiscale modeling; characterization; crystallography; defects; physical properties; innovation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Metallic metastable phases, such as precipitation during casting, forging, and heat treatment or intermetallics in brazing, soldering, and welding, have pivotal influences on the specific strength, toughness, stiffness, and corrosion resistance (etc.) in steels and aluminum-, titanium-, copper-, magnesium-, zirconium-based alloys. Various analytical techniques, including X-ray diffraction (XRD), scanning electrical microscopy (SEM), transmission electron microscopy (TEM), and synchrotron radiation diffraction and tomography combined with multiscale simulation have been applied to study their crystallography, with the purpose of understanding and tailoring the physical properties of the base material.

Due to the complex and delicate crystal structure of metallic metastable phases, involving inherited vacancy, dislocation, stacking fault, twinning, misorientation, etc., multidisciplinary researching is indispensable. Therefore, the present topic offers a platform for integrating interdisciplinary branches with the purpose of bringing together a wide variety of fields (experimental or theoretical), with topics of interest covering, but not limited to, the following:

  • Multiscale modeling the thermal and dynamical behaviors;
  • Phase transformation crystallography;
  • Characterization of crystal structure in different scales;
  • Characterization of misorientation for co-existence phases;
  • Specific strength, toughness, stiffness, and corrosion resistance;
  • Vacancy, dislocation, stacking fault, and twin defects;
  • Innovation hardware and software.

Prof. Dr. Bin Wen
Prof. Dr. Changzeng Fan
Guest Editors

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Keywords

  • metallic metasatable phases
  • crystallography
  • multiscale modeling
  • characterization
  • defects
  • physical properties
  • innovation

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Published Papers (1 paper)

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Research

15 pages, 4344 KiB  
Article
Phase-Field Simulation and Dendrite Evolution Analysis of Solidification Process for Cu-W Alloy Contact Materials under Arc Ablation
by Hanwen Ren, Jian Mu, Siyang Zhao, Junke Li, Yateng Yang, Zhiyun Han, Zexi Xing and Qingmin Li
Metals 2024, 14(10), 1100; https://doi.org/10.3390/met14101100 - 25 Sep 2024
Viewed by 745
Abstract
Cu-W alloys are widely used in high-voltage circuit breaker contacts due to their high resistance to arc ablation, but few studies have analyzed the microstructure of Cu-W alloys under arc ablation. This study applied a phase-field model based on the phase-field model developed [...] Read more.
Cu-W alloys are widely used in high-voltage circuit breaker contacts due to their high resistance to arc ablation, but few studies have analyzed the microstructure of Cu-W alloys under arc ablation. This study applied a phase-field model based on the phase-field model developed by Karma and co-workers to the evolution of dendrite growth in the solidification process of Cu-W alloy under arc ablation. The process of columnar dendrite evolution during solidification was simulated, and the effect of the supercooling degree and anisotropic strength on the morphology of the dendrites during solidification was analyzed. The results show that the solid–liquid interface becomes unstable with the release of latent heat, and competitive growth between dendrites occurs with a large amount of solute discharge. In addition, when the supercooling degree is 289 K, the interface is located at a lower height of only 15 μm, and the growth rate is slow. At high anisotropy, the side branches of the dendrites are more fully developed and tertiary dendritic arms appear, leading to a decrease in the alloy’s relative density and poorer ablation resistance. In contrast, the main dendrites are more developed under high supercooling, which improves the density and ablation resistance of the material. The results in this paper may provide a novel way to study the microstructure evolution and material property changes in Cu-W alloys under the high temperature of the arc for high-voltage circuit breaker contacts. Full article
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