Advances in Field-Assisted Processing of Metallic Materials: Experiments and Simulations

Dear Colleagues,

Traditional processing methods such as thermomechanical processing (TMP) have been used for centuries to improve the properties and microstructure, as well as performance, of metallic materials. However, these processes, e.g., forging, rolling, and extrusion, are energy- and time-intensive. In order to meet the demands for low energy consumption and low greenhouse emissions in today’s manufacturing era, which calls for “green and sustainable technologies”, there has been a growing interest in an integrated approach where other energy fields, such as electrics and magnetics, are coupled with mechanical and thermal approaches to achieve lower processing time and energy. Researchers around the world are exploring various novel energy-efficient processes, such as electropulsing, electrically assisted deformation, electromagnetic processing, electrically assisted annealing/heat treatment, and field-assisted (electric/magnetic/microwave) sintering, spanning from structural, aerospace, medical, to electronics approaches. Besides experimental studies, coupled multiphysics models have been developed to simulate the interplay between thermal, electrical, magnetic, and mechanical effects. These computational simulations complement experimental data by providing insights into the underlying mechanisms and complex interactions between multiple stimuli.

This Special Issue is dedicated to presenting advances in the experimentation and simulation of these novel energy-efficient processes in order to provide and share new insights and practical findings in this field. Potential manuscripts may address, but are not limited to, the following topics:

• Microstructure evolution (grain size, grain boundaries, texture/microtexture, twinning, etc.);
• Phase trans/formation and control (intermetallics, precipitation, etc.);
• Property optimization (strength, nano/microhardness, electrical/thermal conductivity, magnetic, etc.);
• Process optimization (forming, machining, sintering, heat treatment, deposition, coating, additive manufacturing, etc.).

Preference will be given to manuscripts presenting work on coupled fields. Manuscripts covering other coupling stimuli, such as microwaves, lasers, and ultrasound, will also be considered. The submission of research taking multiscale modeling approaches, such as through phase fields, thermodynamics, and molecular dynamics, is strongly encouraged to bridge the gap between atomistic simulations and macroscopic behavior.

Dr. Daudi Waryoba
Dr. Zahabul Islam
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.